Toyo Ohashi

Person

Kitamoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating circuit board
- Patent number 12,108,528
- Issue date Oct 1, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating circuit substrate and method for producing insulating ci...
- Patent number 11,222,835
- Issue date Jan 11, 2022
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing insulated circuit board, insulated circuit...
- Patent number 10,798,824
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module substrate
- Patent number 10,453,783
- Issue date Oct 22, 2019
- Mitsubishi Materials Corporation
- Toyo Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 9,953,944
- Issue date Apr 24, 2018
- Mitsubishi Materials Corporation
- Toyo Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...
- Publication number 20240178115
- Publication date May 30, 2024
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20230411266
- Publication date Dec 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230319975
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230207333
- Publication date Jun 29, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20230164924
- Publication date May 25, 2023
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
- Publication number 20230127557
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD
- Publication number 20230071498
- Publication date Mar 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Toyo Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING CIRCUIT BOARD
- Publication number 20220159829
- Publication date May 19, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING INSULATING CI...
- Publication number 20210020557
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SUBSTRATE
- Publication number 20190189548
- Publication date Jun 20, 2019
- MITSUBISHI MATERIALS CORPORATION
- Toyo OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT...
- Publication number 20190132956
- Publication date May 2, 2019
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20160276302
- Publication date Sep 22, 2016
- MITSUBISHI MATERIALS CORPORATION
- Toyo Ohashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Toyo Ohashi

Person

Patents Grantslast 30 patents

Insulating resin circuit substrate

Bonded body and insulating circuit board

Insulated circuit substrate manufacturing method

Insulating circuit board

Heat sink integrated insulating circuit board

Insulating circuit substrate and method for producing insulating ci...

Method for manufacturing insulated circuit board, insulated circuit...

Power module substrate

Power module

Patents Applicationslast 30 patents

METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...

HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...

INSULATING RESIN CIRCUIT SUBSTRATE

MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE

BONDED BODY AND INSULATING CIRCUIT BOARD

INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD

HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD

INSULATING CIRCUIT BOARD

INSULATING CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING INSULATING CI...

POWER MODULE SUBSTRATE

METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT...

POWER MODULE