Toyoaki SAKAI

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 12,250,773
- Issue date Mar 11, 2025
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 10,170,405
- Issue date Jan 1, 2019
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board including multiple wiring layers that are different in...
- Patent number 9,911,695
- Issue date Mar 6, 2018
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,699,912
- Issue date Jul 4, 2017
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming resist pattern, method for producing circuit boa...
- Patent number 8,143,533
- Issue date Mar 27, 2012
- Mitsubishi Paper Mills Limited
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board manufacturing method and circuit board
- Patent number 7,679,004
- Issue date Mar 16, 2010
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal plate pattern and circuit board
- Patent number 7,454,832
- Issue date Nov 25, 2008
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making circuit board or lead frame
- Patent number 7,005,241
- Issue date Feb 28, 2006
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20230009751
- Publication date Jan 12, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIST LAYER FORMING METHOD, METHOD FOR MANUFACTURING WIRING BOARD,...
- Publication number 20220338354
- Publication date Oct 20, 2022
- Shinko Electric Industries Co., Ltd.
- Yoshihisa KANBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20180019196
- Publication date Jan 18, 2018
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20170098600
- Publication date Apr 6, 2017
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20160316560
- Publication date Oct 27, 2016
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Resist Pattern, Method for Producing Circuit Boa...
- Publication number 20090236137
- Publication date Sep 24, 2009
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20080197294
- Publication date Aug 21, 2008
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board manufacturing method and circuit board
- Publication number 20070181994
- Publication date Aug 9, 2007
- SHINKO ELECTRIC INDUSTRIES CO., LTD
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metal plate pattern and circuit board
- Publication number 20070042585
- Publication date Feb 22, 2007
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metal plate pattern and circuit board
- Publication number 20070017090
- Publication date Jan 25, 2007
- Toyoaki Sakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for making circuit board or lead frame
- Publication number 20050124091
- Publication date Jun 9, 2005
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for making circuit board or lead frame
- Publication number 20040245213
- Publication date Dec 9, 2004
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Toyoaki SAKAI

Person

Patents Grantslast 30 patents

Wiring board and wiring board manufacturing method

Resist layer forming method, method for manufacturing wiring board,...

Wiring substrate and semiconductor package

Wiring board including multiple wiring layers that are different in...

Wiring board

Method for forming resist pattern, method for producing circuit boa...

Circuit board manufacturing method and circuit board

Method of forming metal plate pattern and circuit board

Process for making circuit board or lead frame

Patents Applicationslast 30 patents

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

RESIST LAYER FORMING METHOD, METHOD FOR MANUFACTURING WIRING BOARD,...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING BOARD

WIRING BOARD

Method for Forming Resist Pattern, Method for Producing Circuit Boa...

MANUFACTURING METHOD OF CIRCUIT BOARD

Circuit board manufacturing method and circuit board

Method of forming metal plate pattern and circuit board

Method of forming metal plate pattern and circuit board

Process for making circuit board or lead frame

Process for making circuit board or lead frame