Toyofusa Yoshimura

Person

Nakamachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive agent for substrate of electroless plating, printed circui...
- Patent number 5,356,698
- Issue date Oct 18, 1994
- Hitachi, Ltd.
- Mineo Kawamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing printed circuit board
- Patent number 4,876,177
- Issue date Oct 24, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for electroless copper plating and apparatus used therefor
- Patent number 4,865,888
- Issue date Sep 12, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, process for preparing the same and resist in...
- Patent number 4,610,910
- Issue date Sep 9, 1986
- Hitachi, Ltd.
- Mineo Kawamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacture of printed wiring board
- Patent number 4,604,160
- Issue date Aug 5, 1986
- Hitachi, Ltd.
- Kanji Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing printed circuit boards
- Patent number 4,457,952
- Issue date Jul 3, 1984
- Hitachi, Ltd.
- Mineo Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed circuit board by electroless plating
- Patent number 4,378,384
- Issue date Mar 29, 1983
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for regenerating chemical copper plating solution
- Patent number 4,324,629
- Issue date Apr 13, 1982
- Hitachi, Ltd.
- Hitoshi Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Toyofusa Yoshimura

Person

Patents Grantslast 30 patents

Adhesive agent for substrate of electroless plating, printed circui...

Process for producing printed circuit board

Process for electroless copper plating and apparatus used therefor

Printed circuit board, process for preparing the same and resist in...

Method for manufacture of printed wiring board

Process for producing printed circuit boards

Process for producing printed circuit board by electroless plating

Process for regenerating chemical copper plating solution