Toyokazu Sakata

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and method for manufacturing semiconductor...
- Patent number 9,773,678
- Issue date Sep 26, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Ko Imaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor substrate
- Patent number 9,761,479
- Issue date Sep 12, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Ko Imaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device and method for etch...
- Patent number 7,713,863
- Issue date May 11, 2010
- Oki Semiconductor Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor elemental device forming an...
- Patent number 7,566,617
- Issue date Jul 28, 2009
- Oki Semiconductor Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor element
- Patent number 7,338,881
- Issue date Mar 4, 2008
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and semiconductor device fabricating method
- Patent number 7,300,882
- Issue date Nov 27, 2007
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced interconnection capacity
- Patent number 7,015,137
- Issue date Mar 21, 2006
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 6,930,035
- Issue date Aug 16, 2005
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced interconnection capacity
- Patent number 6,825,566
- Issue date Nov 30, 2004
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 6,790,761
- Issue date Sep 14, 2004
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20170213735
- Publication date Jul 27, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Ko IMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20160204023
- Publication date Jul 14, 2016
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Ko IMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR ETCH...
- Publication number 20080318409
- Publication date Dec 25, 2008
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20070072403
- Publication date Mar 29, 2007
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device and method for etch...
- Publication number 20060205208
- Publication date Sep 14, 2006
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor elemental device
- Publication number 20060199327
- Publication date Sep 7, 2006
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor element
- Publication number 20060105540
- Publication date May 18, 2006
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabrication method
- Publication number 20040266169
- Publication date Dec 30, 2004
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method and semiconductor device fabricating method
- Publication number 20040242011
- Publication date Dec 2, 2004
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with reduced interconnection capacity
- Publication number 20040203226
- Publication date Oct 14, 2004
- Oki Electric Industry Co., Ltd.
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a semiconductor device
- Publication number 20030170974
- Publication date Sep 11, 2003
- Toyokazu Sakata
- H01 - BASIC ELECTRIC ELEMENTS

Toyokazu Sakata

Person

Patents Grantslast 30 patents

Semiconductor substrate and method for manufacturing semiconductor...

Manufacturing method for semiconductor substrate

Method for manufacturing a semiconductor device and method for etch...

Method for manufacturing semiconductor elemental device forming an...

Method for manufacturing semiconductor element

Etching method and semiconductor device fabricating method

Semiconductor device with reduced interconnection capacity

Semiconductor device fabrication method

Semiconductor device with reduced interconnection capacity

Method of fabricating a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR ETCH...

Semiconductor device and method for fabricating the same

Method for manufacturing a semiconductor device and method for etch...

Method for manufacturing semiconductor elemental device

Method for manufacturing semiconductor element

Semiconductor device fabrication method

Etching method and semiconductor device fabricating method

Semiconductor device with reduced interconnection capacity

Method of fabricating a semiconductor device