Toyomitsu SEKI

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Osaka, JP

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Patents Applicationslast 30 patents

Information Patent Application
INSULATED ELECTRICAL WIRE AND RESIN COMPOSITION
- Publication number 20230260672
- Publication date Aug 17, 2023
- DAIKIN INDUSTRIES, LTD.
- Takuma MARUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHA...
- Publication number 20230242771
- Publication date Aug 3, 2023
- DAIKIN INDUSTRIES, LTD.
- Koji NAKANISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE
- Publication number 20230235182
- Publication date Jul 27, 2023
- DAIKIN INDUSTRIES, LTD.
- Koji NAKANISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM, WRAPPING ELECTRIC WIRE COATING MATERIAL, FILM FOR FLEXIBLE PR...
- Publication number 20230174780
- Publication date Jun 8, 2023
- DAIKIN INDUSTRIES, LTD.
- Toyomitsu SEKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND MOLDED ARTICLE
- Publication number 20220010131
- Publication date Jan 13, 2022
- DAIKIN INDUSTRIES, LTD.
- Koji NAKANISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...