Toyotaka Shimabe

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,883,592
- Issue date Jan 30, 2018
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board with built-in electronic component
- Patent number 9,859,221
- Issue date Jan 2, 2018
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with built-in capacitor and method for manufacturing subs...
- Patent number 9,655,249
- Issue date May 16, 2017
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,560,769
- Issue date Jan 31, 2017
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,439,289
- Issue date Sep 6, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,338,891
- Issue date May 10, 2016
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with built-in electronic component and meth...
- Patent number 9,282,635
- Issue date Mar 8, 2016
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 8,952,507
- Issue date Feb 10, 2015
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150382471
- Publication date Dec 31, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150334844
- Publication date Nov 19, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150334842
- Publication date Nov 19, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20150282305
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150271923
- Publication date Sep 24, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN CAPACITOR AND METHOD FOR MANUFACTURING SUBS...
- Publication number 20150264815
- Publication date Sep 17, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20150245492
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140042602
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130182401
- Publication date Jul 18, 2013
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS

Toyotaka Shimabe

Person

Patents Grantslast 30 patents

Wiring board and method for manufacturing the same

Multilayer wiring board with built-in electronic component

Substrate with built-in capacitor and method for manufacturing subs...

Printed wiring board

Wiring board and method for manufacturing the same

Printed wiring board

Multilayer wiring board with built-in electronic component and meth...

Wiring board and method for manufacturing wiring board

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

SUBSTRATE WITH BUILT-IN CAPACITOR AND METHOD FOR MANUFACTURING SUBS...

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME