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Tracey B. Forrest
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Blodgett, OR, US
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last 30 patents
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Patent Grant
System and method for low temperature plasma-enhanced bonding
Patent number
7,261,793
Issue date
Aug 28, 2007
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Fluid manifold for fluid ejection device
Publication number
20080309743
Publication date
Dec 18, 2008
Eric L. Nikkel
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
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Patent Application
System and method for low temperature plasma-enhanced bonding
Publication number
20060032582
Publication date
Feb 16, 2006
Chien-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS