Tracy Autry

Person

Trabuco Canyon, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide semiconductor
- Patent number 8,587,107
- Issue date Nov 19, 2013
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Less expensive high power plastic surface mount package
- Patent number 8,274,164
- Issue date Sep 25, 2012
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage high package pressure semiconductor package
- Patent number 8,237,171
- Issue date Aug 7, 2012
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with flexible planer leads
- Patent number 8,058,719
- Issue date Nov 15, 2011
- Microsemi Corporation
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated circuit with flexible planar leads
- Patent number 8,018,042
- Issue date Sep 13, 2011
- Microsemi Corporation
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flexible diode package and method of manufacturing
- Patent number 8,003,446
- Issue date Aug 23, 2011
- Microsemi Corporation
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Plastic surface mount large area power device
- Patent number 7,741,706
- Issue date Jun 22, 2010
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature, high voltage SiC void-less electronic package
- Patent number 7,435,993
- Issue date Oct 14, 2008
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery cell bypass with pre-loaded compression action
- Patent number 6,294,766
- Issue date Sep 25, 2001
- Microsemi Corporation
- Tracy A. Autry
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging technology for Schottky die
- Patent number 5,923,083
- Issue date Jul 13, 1999
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount package with low coefficient of thermal expansion
- Patent number 5,821,617
- Issue date Oct 13, 1998
- Microsemi Corporation
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE
- Publication number 20130023089
- Publication date Jan 24, 2013
- MICROSEMI CORPORATION
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE
- Publication number 20120326323
- Publication date Dec 27, 2012
- MICROSEMI CORPORATION
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage high package pressure semiconductor package
- Publication number 20110193098
- Publication date Aug 11, 2011
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor
- Publication number 20110193097
- Publication date Aug 11, 2011
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible diode package and method of manufacturing
- Publication number 20100136748
- Publication date Jun 3, 2010
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Less expensive high power plastic surface mount package
- Publication number 20100109147
- Publication date May 6, 2010
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with flexible planar leads
- Publication number 20090134508
- Publication date May 28, 2009
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit with flexible planer leads
- Publication number 20080237827
- Publication date Oct 2, 2008
- Tracy Autry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
High temperature, high voltage SiC Void-led electronic package
- Publication number 20080105958
- Publication date May 8, 2008
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic surface mount large area power device
- Publication number 20080079126
- Publication date Apr 3, 2008
- Tracy Autry
- H01 - BASIC ELECTRIC ELEMENTS

Tracy Autry

Person

Patents Grantslast 30 patents

Silicon carbide semiconductor

Less expensive high power plastic surface mount package

High voltage high package pressure semiconductor package

Integrated circuit with flexible planer leads

Integrated circuit with flexible planar leads

Flexible diode package and method of manufacturing

Plastic surface mount large area power device

High temperature, high voltage SiC void-less electronic package

Battery cell bypass with pre-loaded compression action

Packaging technology for Schottky die

Surface mount package with low coefficient of thermal expansion

Patents Applicationslast 30 patents

LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE

HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE

High voltage high package pressure semiconductor package

Silicon carbide semiconductor

Flexible diode package and method of manufacturing

Less expensive high power plastic surface mount package

Integrated circuit with flexible planar leads

Integrated circuit with flexible planer leads

High temperature, high voltage SiC Void-led electronic package

Plastic surface mount large area power device