Tracy M. Ragan

Person

Warrenton, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate polishing methods
- Patent number 11,367,649
- Issue date Jun 21, 2022
- GlobalWafers Co., Ltd.
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing slurries for polishing semiconductor wafers
- Patent number 10,811,307
- Issue date Oct 20, 2020
- GlobalWafers Co., Ltd.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate polishing methods and slurries and methods...
- Patent number 10,128,146
- Issue date Nov 13, 2018
- GlobalWafers Co., Ltd.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to recover and purify silicon particles from saw kerf
- Patent number 8,528,740
- Issue date Sep 10, 2013
- MEMC Singapore Pte. Ltd. (UEN200614794D)
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods to slice a silicon ingot
- Patent number 8,505,733
- Issue date Aug 13, 2013
- MEMC Singapore Pte. Ltd.
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods to recover and purify silicon particles from saw kerf
- Patent number 8,231,006
- Issue date Jul 31, 2012
- MEMC Singapore Pte. Ltd.
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer carrier
- Patent number 7,008,308
- Issue date Mar 7, 2006
- MEMC Electronic Materials, Inc.
- Mick Bjelopavlic
- B24 - GRINDING POLISHING
Information Patent Grant
Method of slicing silicon wafers for laser marking
- Patent number 6,112,738
- Issue date Sep 5, 2000
- MEMC Electronics Materials, Inc.
- Dale A. Witte
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS
- Publication number 20210013092
- Publication date Jan 14, 2021
- GLOBALWAFERS CO., LTD.
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing Slurries for Polishing Semiconductor Wafers
- Publication number 20190035675
- Publication date Jan 31, 2019
- Global Wafers Co., Ltd
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLIN...
- Publication number 20180151384
- Publication date May 31, 2018
- SUNEDISON SEMICONDUCTOR LIMITED
- Guoqiang David Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...
- Publication number 20170256439
- Publication date Sep 7, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...
- Publication number 20170053826
- Publication date Feb 23, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR CLEANING SEMICONDUCTOR SUBSTRATES
- Publication number 20150357180
- Publication date Dec 10, 2015
- SunEdison Semiconductor Limited (UEN201334164H)
- Sasha Joseph Kweskin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF
- Publication number 20120027660
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO SLICE A SILICON INGOT
- Publication number 20120024761
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF
- Publication number 20100163462
- Publication date Jul 1, 2010
- MEMC Electronic Materials, Inc.
- Alexis Grabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer carrier
- Publication number 20040235402
- Publication date Nov 25, 2004
- MEMC Electronic Materials, Inc.
- Mick Bjelopavlic
- B24 - GRINDING POLISHING
Information Patent Application
Method for processing a semiconductor wafer using double-side polis...
- Publication number 20040038544
- Publication date Feb 26, 2004
- MEMC Electronic Materials, Inc.
- Guoqiang (David) Zhang
- B24 - GRINDING POLISHING

Tracy M. Ragan

Person

Patents Grantslast 30 patents

Semiconductor substrate polishing methods

Polishing slurries for polishing semiconductor wafers

Semiconductor substrate polishing methods and slurries and methods...

Methods to recover and purify silicon particles from saw kerf

Methods to slice a silicon ingot

Methods to recover and purify silicon particles from saw kerf

Wafer carrier

Method of slicing silicon wafers for laser marking

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE POLISHING METHODS

Polishing Slurries for Polishing Semiconductor Wafers

METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLIN...

SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...

SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...

METHODS FOR CLEANING SEMICONDUCTOR SUBSTRATES

METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF

METHODS TO SLICE A SILICON INGOT

METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF

Wafer carrier

Method for processing a semiconductor wafer using double-side polis...