TREA

Travis Deleve

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  • Boise, ID, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lattice cutting machine system
    • Patent number 9,352,479
    • Issue date May 31, 2016
    • J.R. SIMPLOT COMPANY
    • David Bruce Walker
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Grant

    Semiconductor wafer chuck and method
    • Patent number 9,349,602
    • Issue date May 24, 2016
    • JST MANUFACTURING, INC.
    • Jacob Stafford
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

  • Information Patent Application

    LATTICE CUTTING MACHINE SYSTEM
    • Publication number 20160243716
    • Publication date Aug 25, 2016
    • J.R. SIMPLOT COMPANY
    • David Bruce Walker
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    SEMICONDUCTOR WAFER CHUCK AND METHOD
    • Publication number 20140322919
    • Publication date Oct 30, 2014
    • JST Manufacturing Inc.
    • Jacob Stafford
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LATTICE CUTTING MACHINE SYSTEM
    • Publication number 20130205965
    • Publication date Aug 15, 2013
    • J.R. SIMPLOT
    • David Bruce Walker
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING