Travis LAJOIE

Person

Forest Grove, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two transistor memory cell using stacked thin-film transistors
- Patent number 12,238,913
- Issue date Feb 25, 2025
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional capacitors with double metal electrodes
- Patent number 12,176,147
- Issue date Dec 24, 2024
- Intel Corporation
- James D. Waldemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors, memory cells, and arrangements thereof
- Patent number 12,148,734
- Issue date Nov 19, 2024
- Intel Corporation
- Sarah Atanasov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin film fin transistor structure
- Patent number 12,080,781
- Issue date Sep 3, 2024
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,991,873
- Issue date May 21, 2024
- Intel Corporation
- Travis W. Lajoie
Information Patent Grant
Passivation layers for thin film transistors and methods of fabrica...
- Patent number 11,955,560
- Issue date Apr 9, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory architecture with shared bitline at back-end-of-line
- Patent number 11,950,407
- Issue date Apr 2, 2024
- Intel Corporation
- Juan G. Alzate Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors with offset source and drain structures and p...
- Patent number 11,929,415
- Issue date Mar 12, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor connections in dielectric layers
- Patent number 11,832,438
- Issue date Nov 28, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,758,711
- Issue date Sep 12, 2023
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making memory cells based on thin-film transistors
- Patent number 11,683,929
- Issue date Jun 20, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate separation layers at the back-end-of-line
- Patent number 11,652,047
- Issue date May 16, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,610,894
- Issue date Mar 21, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with air-gaps to reduce coupling capacitance and process for...
- Patent number 11,574,910
- Issue date Feb 7, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of contact patterning of thin film transistors for embedded...
- Patent number 11,563,107
- Issue date Jan 24, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cells based on vertical thin-film transistors
- Patent number 11,462,541
- Issue date Oct 4, 2022
- Intel Corporation
- Juan G. Alzate Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked thin-film transistor based embedded dynamic random-access m...
- Patent number 11,450,669
- Issue date Sep 20, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor structures with gas spacer
- Patent number 11,404,536
- Issue date Aug 2, 2022
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cells based on thin-film transistors
- Patent number 11,393,927
- Issue date Jul 19, 2022
- Intel Coropration
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,329,047
- Issue date May 10, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 11,121,073
- Issue date Sep 14, 2021
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...
- Publication number 20240234579
- Publication date Jul 11, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20240049450
- Publication date Feb 8, 2024
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR (TF...
- Publication number 20230369503
- Publication date Nov 16, 2023
- Intel Corporation
- Cheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR...
- Publication number 20230369426
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SIDEWALL FEATURES FOR TUNING THIN FILM TRANSISTOR (TFT)...
- Publication number 20230369501
- Publication date Nov 16, 2023
- Intel Corporation
- Cheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY RECESSED GATE ELECTRODE IN THIN FILM TRANSISTORS
- Publication number 20230369506
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED OR GRADED GATE DIELECTRIC IN THIN FILM TRANSISTOR (TF...
- Publication number 20230369444
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER MEMORY STRUCTURE WITH GRADED CHARACTERISTICS
- Publication number 20230371233
- Publication date Nov 16, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ETCH STOP LAYERS
- Publication number 20230317615
- Publication date Oct 5, 2023
- Intel Corporation
- Deepyanti Taneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS USED IN BACKEND MEMORY STRUCTURES
- Publication number 20230307352
- Publication date Sep 28, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION THROUGH AN ETCH STOP LAYER
- Publication number 20230307291
- Publication date Sep 28, 2023
- Intel Corporation
- Moshe Dolejsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY
- Publication number 20230290812
- Publication date Sep 14, 2023
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...
- Publication number 20230290722
- Publication date Sep 14, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER-BASED SELF-ALIGNED INTERCONNECT FEATURES
- Publication number 20230290726
- Publication date Sep 14, 2023
- Intel Corporation
- Moshe Dolejsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20230200043
- Publication date Jun 22, 2023
- Intel Corporation
- Travis W. LAJOIE
Information Patent Application
TWO TRANSISTOR MEMORY CELL USING STACKED THIN-FILM TRANSISTORS
- Publication number 20230171936
- Publication date Jun 1, 2023
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUITS WITH INTERCONNECT LINERS
- Publication number 20230097793
- Publication date Mar 30, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...
- Publication number 20230067765
- Publication date Mar 2, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITORS AND METHODS OF FABRICATION
- Publication number 20220415896
- Publication date Dec 29, 2022
- Intel Corporation
- Juan G. Alzate-Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CAPACITORS WITH DOUBLE METAL ELECTRODES
- Publication number 20220415573
- Publication date Dec 29, 2022
- Intel Corporation
- James D. Waldemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM
- Publication number 20220415897
- Publication date Dec 29, 2022
- Intel Corporation
- Juan G. Alzate-Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS
- Publication number 20220406782
- Publication date Dec 22, 2022
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20220320275
- Publication date Oct 6, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS BASED ON THIN-FILM TRANSISTORS
- Publication number 20220310849
- Publication date Sep 29, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...
- Publication number 20220208770
- Publication date Jun 30, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE
- Publication number 20220199807
- Publication date Jun 23, 2022
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS HAVING A BACKSIDE CHANNEL CONTACT FOR HIGH DE...
- Publication number 20220199628
- Publication date Jun 23, 2022
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS, MEMORY CELLS, AND ARRANGEMENTS THEREOF
- Publication number 20220189913
- Publication date Jun 16, 2022
- Intel Corporation
- Sarah Atanasov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS, MEMORY CELLS, AND ARRANGEMENTS THEREOF
- Publication number 20220189957
- Publication date Jun 16, 2022
- Intel Corporation
- Sarah Atanasov
- G11 - INFORMATION STORAGE
Information Patent Application
DOUBLE WALL CAPACITORS AND METHODS OF FABRICATION
- Publication number 20210408002
- Publication date Dec 30, 2021
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS

Travis LAJOIE

Person

Patents Grantslast 30 patents

Two transistor memory cell using stacked thin-film transistors

Through plate interconnect for a vertical MIM capacitor

Three-dimensional capacitors with double metal electrodes

Transistors, memory cells, and arrangements thereof

Fabrication of thin film fin transistor structure

Integrated circuit structures having differentiated interconnect li...

Capacitor separations in dielectric layers

Passivation layers for thin film transistors and methods of fabrica...

Memory architecture with shared bitline at back-end-of-line

Thin film transistors with offset source and drain structures and p...

Capacitor connections in dielectric layers

Thin-film transistor embedded dynamic random-access memory with sha...

Method for making memory cells based on thin-film transistors

Intermediate separation layers at the back-end-of-line

Capacitor separations in dielectric layers

Device with air-gaps to reduce coupling capacitance and process for...

Method of contact patterning of thin film transistors for embedded...

Memory cells based on vertical thin-film transistors

Stacked thin-film transistor based embedded dynamic random-access m...

Thin-film transistor structures with gas spacer

Memory cells based on thin-film transistors

Thin-film transistor embedded dynamic random-access memory with sha...

Through plate interconnect for a vertical MIM capacitor

Patents Applicationslast 30 patents

PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

ASYMMETRIC SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR (TF...

MULTI-LAYERED SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR...

DIELECTRIC SIDEWALL FEATURES FOR TUNING THIN FILM TRANSISTOR (TFT)...

LATERALLY RECESSED GATE ELECTRODE IN THIN FILM TRANSISTORS

MULTI-LAYERED OR GRADED GATE DIELECTRIC IN THIN FILM TRANSISTOR (TF...

MULTI-TIER MEMORY STRUCTURE WITH GRADED CHARACTERISTICS

HYBRID ETCH STOP LAYERS

AIRGAPS USED IN BACKEND MEMORY STRUCTURES

IMPLANTATION THROUGH AN ETCH STOP LAYER

DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY

PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...

SPACER-BASED SELF-ALIGNED INTERCONNECT FEATURES

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

TWO TRANSISTOR MEMORY CELL USING STACKED THIN-FILM TRANSISTORS

INTEGRATED CIRCUITS WITH INTERCONNECT LINERS

BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...

DECOUPLING CAPACITORS AND METHODS OF FABRICATION

THREE-DIMENSIONAL CAPACITORS WITH DOUBLE METAL ELECTRODES

MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM

BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

MEMORY CELLS BASED ON THIN-FILM TRANSISTORS

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...

FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE

THIN FILM TRANSISTORS HAVING A BACKSIDE CHANNEL CONTACT FOR HIGH DE...

TRANSISTORS, MEMORY CELLS, AND ARRANGEMENTS THEREOF

TRANSISTORS, MEMORY CELLS, AND ARRANGEMENTS THEREOF

DOUBLE WALL CAPACITORS AND METHODS OF FABRICATION