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Trent S. Uehling
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New Braunfels, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Device package substrate structure and method therefor
Patent number
11,798,871
Issue date
Oct 24, 2023
NXP USA, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating embedded traces
Patent number
11,018,024
Issue date
May 25, 2021
NXP USA, INC.
Trent Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple interconnections between die
Patent number
10,037,970
Issue date
Jul 31, 2018
NXP USA, INC.
David Clegg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser sintered interconnections between die
Patent number
9,935,079
Issue date
Apr 3, 2018
NXP USA, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper tube interconnect
Patent number
9,703,056
Issue date
Jul 11, 2017
NXP USA, INC.
Sriram Neelakantan
G02 - OPTICS
Information
Patent Grant
Methods and structures for detecting low strength in an interlayer...
Patent number
9,659,831
Issue date
May 23, 2017
NXP USA, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader and method for forming
Patent number
9,548,256
Issue date
Jan 17, 2017
NXP USA, INC.
Trent S. Uehling
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate core via structure
Patent number
9,496,212
Issue date
Nov 15, 2016
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconducitive catechol group encapsulant adhesion promoter for a...
Patent number
9,466,544
Issue date
Oct 11, 2016
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink having a through-opening
Patent number
9,385,064
Issue date
Jul 5, 2016
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Collapsible probe tower device and method of forming thereof
Patent number
9,373,539
Issue date
Jun 21, 2016
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with compliant interconnects
Patent number
9,324,667
Issue date
Apr 26, 2016
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding capillary with working tip protrusion
Patent number
9,093,515
Issue date
Jul 28, 2015
FREESCALE SEMICONDUCTOR, INC.
Trent Uehling
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat conductive substrate for integrated circuit package
Patent number
9,070,657
Issue date
Jun 30, 2015
FREESCALE SEMICONDUCTOR, INC.
Tim V. Pham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-temperature flip chip die attach
Patent number
8,994,190
Issue date
Mar 31, 2015
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer plating bus and method for forming
Patent number
8,895,409
Issue date
Nov 25, 2014
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit having large solder pads and method for...
Patent number
8,766,453
Issue date
Jul 1, 2014
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having an air gap and method for fo...
Patent number
8,704,370
Issue date
Apr 22, 2014
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer plating bus
Patent number
8,519,513
Issue date
Aug 27, 2013
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fused buss for plating features on a semiconductor die
Patent number
8,368,172
Issue date
Feb 5, 2013
FREESCALE SEMICONDUCTOR, INC.
George R. Leal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fused buss for plating features on a semiconductor die
Patent number
8,349,666
Issue date
Jan 8, 2013
FREESCALE SEMICONDUCTOR, INC.
George R. Leal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anchored conductive via and method for forming
Patent number
8,314,026
Issue date
Nov 20, 2012
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic pad size to reduce solder fatigue
Patent number
8,008,786
Issue date
Aug 30, 2011
FREESCALE SEMICONDUCTOR, INC.
Tim V. Pham
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dynamic pad size to reduce solder fatigue
Patent number
7,772,104
Issue date
Aug 10, 2010
FREESCALE SEMICONDUCTOR, INC.
Tim V. Pham
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Die level metal density gradient for improved flip chip package rel...
Patent number
7,276,435
Issue date
Oct 2, 2007
FREESCALE SEMICONDUCTOR, INC.
Scott K. Pozder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scribe street structure for backend interconnect semiconductor wafe...
Patent number
7,129,566
Issue date
Oct 31, 2006
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal reduction in wafer scribe area
Patent number
6,951,801
Issue date
Oct 4, 2005
FREESCALE SEMICONDUCTOR, INC.
Scott K. Pozder
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
Publication number
20240112989
Publication date
Apr 4, 2024
NXP USA, Inc.
Trent Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR
Publication number
20240014114
Publication date
Jan 11, 2024
NXP USA, Inc.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR
Publication number
20220059441
Publication date
Feb 24, 2022
NXP USA, Inc.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE WITH EMBEDDED TRACES
Publication number
20200043750
Publication date
Feb 6, 2020
NXP USA, Inc.
Trent Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE INTERCONNECTIONS BETWEEN DIE
Publication number
20180068980
Publication date
Mar 8, 2018
FREESCALE SEMICONDUCTOR, INC.
David Clegg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A...
Publication number
20160372339
Publication date
Dec 22, 2016
FREESCALE SEMICONDUCTOR, INC.
TRENT S. UEHLING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SPREADER AND METHOD FOR FORMING
Publication number
20160247744
Publication date
Aug 25, 2016
FREESCALE SEMICONDUCTOR, INC.
TRENT S. UEHLING
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SUBSTRATE CORE VIA STRUCTURE
Publication number
20160181191
Publication date
Jun 23, 2016
FREESCALE SEMICONDUCTOR, INC.
TRENT S. UEHLING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES FOR DETECTING LOW STRENGTH IN AN INTERLAYER...
Publication number
20160027705
Publication date
Jan 28, 2016
TRENT S. UEHLING
G01 - MEASURING TESTING
Information
Patent Application
HEAT SINK HAVING A RESTRICTIVE REGION
Publication number
20150311136
Publication date
Oct 29, 2015
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Collapsible Probe Tower Device and Method of Forming Thereof
Publication number
20150287654
Publication date
Oct 8, 2015
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper Tube Interconnect
Publication number
20150205041
Publication date
Jul 23, 2015
FREESCALE SEMICONDUCTOR, INC.
Sriram Neelakantan
G02 - OPTICS
Information
Patent Application
HEAT CONDUCTIVE SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE
Publication number
20150097280
Publication date
Apr 9, 2015
Tim V. Pham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING CAPILLARY WITH WORKING TIP PROTRUSION
Publication number
20150021376
Publication date
Jan 22, 2015
FREESCALE SEMICONDUCTOR, INC.
Trent Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A...
Publication number
20140210063
Publication date
Jul 31, 2014
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING LARGE SOLDER PADS AND METHOD FOR...
Publication number
20140117554
Publication date
May 1, 2014
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FO...
Publication number
20140001632
Publication date
Jan 2, 2014
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-TEMPERATURE FLIP CHIP DIE ATTACH
Publication number
20130313726
Publication date
Nov 28, 2013
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER PLATING BUS AND METHOD FOR FORMING
Publication number
20130309860
Publication date
Nov 21, 2013
FREESCALE SEMICONDUCTOR, INC.
TRENT S. UEHLING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATED TEST STRUCTURES TO ENABLE SAW SINGULATION OF WAFER
Publication number
20130299947
Publication date
Nov 14, 2013
FREESCALE SEMICONDUCTOR, INC.
Trent S. Uehling
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS
Publication number
20130181340
Publication date
Jul 18, 2013
Trent S. UEHLING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER PLATING BUS
Publication number
20130168830
Publication date
Jul 4, 2013
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE
Publication number
20130020674
Publication date
Jan 24, 2013
GEORGE R. LEAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE
Publication number
20130023091
Publication date
Jan 24, 2013
GEORGE R. LEAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANCHORED CONDUCTIVE VIA AND METHOD FOR FORMING
Publication number
20120211883
Publication date
Aug 23, 2012
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC PAD SIZE TO REDUCE SOLDER FATIGUE
Publication number
20100264542
Publication date
Oct 21, 2010
Freescale Semiconductor Inc.
Tim V. Pham
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Dynamic pad size to reduce solder fatigue
Publication number
20080185735
Publication date
Aug 7, 2008
Freescale Semiconductor, Inc.
Tim V. Pham
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Scribe street structure for backend interconnect semiconductor wafe...
Publication number
20060001144
Publication date
Jan 5, 2006
Trent S. Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal reduction in wafer scribe area
Publication number
20040147097
Publication date
Jul 29, 2004
Scott K. Pozder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect system and method of fabrication
Publication number
20030006062
Publication date
Jan 9, 2003
William M. Stone
H01 - BASIC ELECTRIC ELEMENTS