Trianggono WIDODO

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Hillsboro, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Publication number 20250006678
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING
- Publication number 20240113073
- Publication date Apr 4, 2024
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS