Troy D. Schwinabart

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Corvallis, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication tool for bonding
- Patent number 7,866,364
- Issue date Jan 11, 2011
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement of absorbing material in a semiconductor device
- Patent number 7,442,576
- Issue date Oct 28, 2008
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement of absorbing material in a semiconductor device
- Patent number 7,045,885
- Issue date May 16, 2006
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication tool for bonding
- Publication number 20070274669
- Publication date Nov 29, 2007
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Placement of Absorbing Material in a Semiconductor Device
- Publication number 20060189035
- Publication date Aug 24, 2006
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component packaging
- Publication number 20060033188
- Publication date Feb 16, 2006
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS