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Troy L. Graves-Abe
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Wappingers Falls, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Architecture and implementation of cortical system, and fabricating...
Patent number
10,613,754
Issue date
Apr 7, 2020
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Architecture and implementation of cortical system, and fabricating...
Patent number
10,503,402
Issue date
Dec 10, 2019
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Implant after through-silicon via (TSV) etch to getter mobile ions
Patent number
10,170,337
Issue date
Jan 1, 2019
International Business Machines Corporation
Christopher Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture and implementation of cortical system, and fabricating...
Patent number
9,886,193
Issue date
Feb 6, 2018
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
Patent number
9,640,514
Issue date
May 2, 2017
GLOBALFOUNDRIES Inc.
Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method to determine through silicon via build integrity
Patent number
9,476,927
Issue date
Oct 25, 2016
GLOBALFOUNDRIES, INC.
Troy L. Graves-Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3-D integration using multi stage vias
Patent number
9,263,324
Issue date
Feb 16, 2016
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bottom-up plating of through-substrate vias
Patent number
9,257,336
Issue date
Feb 9, 2016
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
Patent number
9,252,133
Issue date
Feb 2, 2016
GLOBALFOUNDRIES Inc.
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via structure for three-dimensional circuit integration
Patent number
9,214,435
Issue date
Dec 15, 2015
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sidewalls of electroplated copper interconnects
Patent number
9,060,457
Issue date
Jun 16, 2015
International Business Machines Corporation
Mukta G. Farooq
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sidewalls of electroplated copper interconnects
Patent number
9,055,703
Issue date
Jun 9, 2015
International Business Machines Corporation
Mukta G. Farooq
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sidewalls of electroplated copper interconnects
Patent number
9,040,407
Issue date
May 26, 2015
International Business Machines Corporation
Mukta G. Farooq
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Through-silicon-via with sacrificial dielectric line
Patent number
8,975,910
Issue date
Mar 10, 2015
International Business Machines Corporation
Troy L. Graves-Abe
G01 - MEASURING TESTING
Information
Patent Grant
Bottom-up plating of through-substrate vias
Patent number
8,956,973
Issue date
Feb 17, 2015
International Business Machines Corporation
Mukta G. Farooq
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of forming a through-silicon via utilizing a metal contact p...
Patent number
8,951,906
Issue date
Feb 10, 2015
International Business Machines Corporation
Mukta G Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anticipatory implant for TSV
Patent number
8,927,427
Issue date
Jan 6, 2015
International Business Machines Corporation
Troy L. Graves-Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
Patent number
8,907,494
Issue date
Dec 9, 2014
International Business Machines Corporation
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a through-silicon via utilizing a metal contact p...
Patent number
8,889,542
Issue date
Nov 18, 2014
International Business Machines Corporation
Mukta G Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3-D integration using multi stage vias
Patent number
8,853,857
Issue date
Oct 7, 2014
International Business Machines Corporation
Mukta G Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sidewalls of electroplated copper interconnects
Patent number
8,791,005
Issue date
Jul 29, 2014
International Business Machines Corporation
Mukta G. Farooq
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a through-silicon via utilizing a metal contact p...
Patent number
8,791,009
Issue date
Jul 29, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TSV pillar as an interconnecting structure
Patent number
8,691,691
Issue date
Apr 8, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment marks to enable 3D integration
Patent number
8,546,961
Issue date
Oct 1, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-conformal hardmask deposition for through silicon etch
Patent number
8,476,168
Issue date
Jul 2, 2013
International Business Machines Corporation
Troy L. Graves-Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-situ silicon cap for metal gate electrode
Patent number
8,138,041
Issue date
Mar 20, 2012
International Business Machines Corporation
Michael P. Chudzik
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
Publication number
20200042182
Publication date
Feb 6, 2020
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
Publication number
20180136846
Publication date
May 17, 2018
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
IMPLANT AFTER THROUGH-SILICON VIA (TSV) ETCH TO GETTER MOBILE IONS
Publication number
20170200620
Publication date
Jul 13, 2017
International Business Machines Corporation
Christopher Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
Publication number
20160334991
Publication date
Nov 17, 2016
International Business Machines Corporation
Daniel G. Berger
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STRUCTURE AND METHOD TO DETERMINE THROUGH SILICON VIA BUILD INTEGRITY
Publication number
20150204932
Publication date
Jul 23, 2015
International Business Machines Corporation
Troy L. Graves-Abe
G01 - MEASURING TESTING
Information
Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
Publication number
20150097274
Publication date
Apr 9, 2015
International Business Machines Corporation
Christopher Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
Publication number
20150069608
Publication date
Mar 12, 2015
International Business Machines Corporation
Christopher Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOTTOM-UP PLATING OF THROUGH-SUBSTRATE VIAS
Publication number
20150056804
Publication date
Feb 26, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION
Publication number
20150035169
Publication date
Feb 5, 2015
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL LEAKAGE REDUCTION IN STACKED INTEGRATED CIRCUITS HAVING...
Publication number
20150004749
Publication date
Jan 1, 2015
International Business Machines Corporation
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
Publication number
20140342552
Publication date
Nov 20, 2014
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTICIPATORY IMPLANT FOR TSV
Publication number
20140319694
Publication date
Oct 30, 2014
International Business Machines Corporation
Troy L. Graves-Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT
Publication number
20140264756
Publication date
Sep 18, 2014
International Business Machines Corporation
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
Publication number
20140227870
Publication date
Aug 14, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3-D INTEGRATION USING MULTI STAGE VIAS
Publication number
20140073134
Publication date
Mar 13, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTION OF THRU-SUBSTRATE VIA PISTONING USING HIGHLY DOPED COPPE...
Publication number
20140061915
Publication date
Mar 6, 2014
International Business Machines Corporation
Christopher N. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
Publication number
20140027296
Publication date
Jan 30, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
Publication number
20140027911
Publication date
Jan 30, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
Publication number
20140027912
Publication date
Jan 30, 2014
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
Publication number
20130334691
Publication date
Dec 19, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Via Structure For Three-Dimensional Circuit Integration
Publication number
20130307160
Publication date
Nov 21, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SILICON-VIA WITH SACRIFICIAL DIELECTRIC LINE
Publication number
20130285694
Publication date
Oct 31, 2013
International Business Machines Corporation
Troy L. Graves-Abe
G01 - MEASURING TESTING
Information
Patent Application
BOTTOM-UP PLATING OF THROUGH-SUBSTRATE VIAS
Publication number
20130260556
Publication date
Oct 3, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
Publication number
20130026606
Publication date
Jan 31, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
Publication number
20120315753
Publication date
Dec 13, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3-D Integration using Multi Stage Vias
Publication number
20120280395
Publication date
Nov 8, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-CONFORMAL HARDMASK DEPOSITION FOR THROUGH SILICON ETCH
Publication number
20120190204
Publication date
Jul 26, 2012
International Business Machines Corporation
Troy L. Graves-Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT MARKS TO ENABLE 3D INTEGRATION
Publication number
20120175789
Publication date
Jul 12, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-SITU SILICON CAP FOR METAL GATE ELECTRODE
Publication number
20090308636
Publication date
Dec 17, 2009
International Business Machines Corporation
Michael P Chudzik
H01 - BASIC ELECTRIC ELEMENTS