Troy S. Detrick

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for analyzing thermal properties of composite...
- Patent number 8,878,926
- Issue date Nov 4, 2014
- Applied Materials, Inc.
- Zheng John Ye
- G01 - MEASURING TESTING
Information Patent Grant
Plasma process uniformity across a wafer by controlling a variable...
- Patent number 8,080,479
- Issue date Dec 20, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma process uniformity across a wafer by controlling RF phase be...
- Patent number 8,076,247
- Issue date Dec 13, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor with reduced electrical skew using electrical bypass...
- Patent number 7,988,815
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Shahid Rauf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece in a plasma reactor with variable...
- Patent number 7,968,469
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process uniformity across a wafer by apportioning ground ret...
- Patent number 7,884,025
- Issue date Feb 8, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Improving plasma process uniformity across a wafer by apportioning...
- Patent number 7,879,731
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control using dual cathode frequency mixing
- Patent number 7,838,430
- Issue date Nov 23, 2010
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductively coupled HDP-CVD reactor
- Patent number 6,182,602
- Issue date Feb 6, 2001
- Applied Materials, Inc.
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone RF inductively coupled source configuration
- Patent number 6,083,344
- Issue date Jul 4, 2000
- Applied Materials, Inc.
- Hiroji Hanawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL (3D) PROCESSING AND PRINTING WITH PLASMA SOURCES
- Publication number 20150042017
- Publication date Feb 12, 2015
- Applied Materials, Inc.
- Kartik RAMASWAMY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR ANALYZING THERMAL PROPERTIES OF COMPOSITE...
- Publication number 20120069174
- Publication date Mar 22, 2012
- Applied Materials, Inc.
- Zheng John Ye
- G01 - MEASURING TESTING
Information Patent Application
PLASMA REACTOR WITH REDUCED ELECTRICAL SKEW USING ELECTRICAL BYPASS...
- Publication number 20090025878
- Publication date Jan 29, 2009
- Shahid Rauf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH REDUCED ELECTRICAL SKEW USING A CONDUCTIVE BAFFLE
- Publication number 20090025879
- Publication date Jan 29, 2009
- Shahid Rauf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING GROUND RET...
- Publication number 20080182417
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING A VARIABLE...
- Publication number 20080182418
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING RF PHASE BE...
- Publication number 20080180028
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH VARIABLE...
- Publication number 20080179181
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING POWER AMON...
- Publication number 20080182416
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH ION DISTRIBUTION UNIFORMITY CONTROLLER EMPLOYIN...
- Publication number 20080178803
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH WIDE PROCESS WINDOW EMPLOYING PLURAL VHF SOURCES
- Publication number 20080179011
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING
- Publication number 20070000611
- Publication date Jan 4, 2007
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma control using dual cathode frequency mixing
- Publication number 20050090118
- Publication date Apr 28, 2005
- APPLIED MATERIALS, INC.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS

Troy S. Detrick

Person

Patents Grantslast 30 patents

Apparatus and method for analyzing thermal properties of composite...

Plasma process uniformity across a wafer by controlling a variable...

Plasma process uniformity across a wafer by controlling RF phase be...

Plasma reactor with reduced electrical skew using electrical bypass...

Method of processing a workpiece in a plasma reactor with variable...

Plasma process uniformity across a wafer by apportioning ground ret...

Improving plasma process uniformity across a wafer by apportioning...

Plasma control using dual cathode frequency mixing

Inductively coupled HDP-CVD reactor

Multi-zone RF inductively coupled source configuration

Patents Applicationslast 30 patents

THREE-DIMENSIONAL (3D) PROCESSING AND PRINTING WITH PLASMA SOURCES

APPARATUS AND METHOD FOR ANALYZING THERMAL PROPERTIES OF COMPOSITE...

PLASMA REACTOR WITH REDUCED ELECTRICAL SKEW USING ELECTRICAL BYPASS...

PLASMA REACTOR WITH REDUCED ELECTRICAL SKEW USING A CONDUCTIVE BAFFLE

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING GROUND RET...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING A VARIABLE...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING RF PHASE BE...

METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH VARIABLE...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING POWER AMON...

PLASMA REACTOR WITH ION DISTRIBUTION UNIFORMITY CONTROLLER EMPLOYIN...

PLASMA REACTOR WITH WIDE PROCESS WINDOW EMPLOYING PLURAL VHF SOURCES

PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING

Plasma control using dual cathode frequency mixing