Trung Q. Duong

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Package with support structure
- Patent number 10,431,534
- Issue date Oct 1, 2019
- NXP USA, INC.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and methods for producing wafer level packages...
- Patent number 9,502,363
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having layered interconnect structures and...
- Patent number 9,281,293
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with die pad pattern
- Patent number 7,834,466
- Issue date Nov 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH SUPPORT STRUCTURE
- Publication number 20190181079
- Publication date Jun 13, 2019
- NXP USA, Inc.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
- Publication number 20150270233
- Publication date Sep 24, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
- Publication number 20150115454
- Publication date Apr 30, 2015
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH DIE PAD PATTERN
- Publication number 20090152718
- Publication date Jun 18, 2009
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS