Tsai-Tsung Tsai

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material
- Patent number 11,776,945
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,075,131
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method of forming t...
- Patent number 11,056,474
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 10,985,122
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 10,510,697
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package structure including a thermal isolation material...
- Patent number 10,490,539
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for stud bump formation
- Patent number 10,147,693
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method of forming t...
- Patent number 10,134,717
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 10,032,734
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method of forming t...
- Patent number 9,530,762
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 9,449,908
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material...
- Patent number 9,418,971
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,385,040
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stud bump formation
- Patent number 9,021,682
- Issue date May 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fine-pitch package-on-package structures and methods for forming th...
- Patent number 8,900,922
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in a package-on-package structure
- Patent number 8,846,448
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE
- Publication number 20240404954
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material
- Publication number 20230378153
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20210242150
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210057298
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20200144206
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200020634
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20200020677
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Device and Method of Forming t...
- Publication number 20190088635
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20180331055
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Device and Method of Forming t...
- Publication number 20170092634
- Publication date Mar 30, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20170005049
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20160343698
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20160035663
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Stud Bump Formation and Apparatus for Performing the Same
- Publication number 20150235975
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20150235902
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- TSAI-TSUNG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING T...
- Publication number 20150200188
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- CHEN-HUA YU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL...
- Publication number 20140124955
- Publication date May 8, 2014
- Meng-Tse CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch Package-on-Package Structure
- Publication number 20140042622
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20140045300
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine-Pitch Package-on-Package Structures and Methods for Forming th...
- Publication number 20130214431
- Publication date Aug 22, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Stud Bump Formation and Apparatus for Performing the Same
- Publication number 20130167373
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Tsai-Tsung Tsai

Person

Patents Grantslast 30 patents

Semiconductor package system and method

Package-on-package structure including a thermal isolation material

Semiconductor package and method of forming the same

Semiconductor package, semiconductor device and method of forming t...

Semiconductor package system and method

Semiconductor package system and method

Package on-package structure including a thermal isolation material...

Methods for stud bump formation

Semiconductor package, semiconductor device and method of forming t...

Semiconductor package system and method

Semiconductor package, semiconductor device and method of forming t...

Semiconductor package system and method

Package-on-package structure including a thermal isolation material...

Method of manufacturing a semiconductor device

Apparatus for stud bump formation

Fine-pitch package-on-package structures and methods for forming th...

Warpage control in a package-on-package structure

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

Package-on-Package Structure Including a Thermal Isolation Material

Semiconductor Package System and Method

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor Package System and Method

PACKAGE AND METHOD OF MANUFACTURING THE SAME

Package-on-Package Structure Including a Thermal Isolation Material...

Semiconductor Package, Semiconductor Device and Method of Forming t...

Semiconductor Package System and Method

Semiconductor Package, Semiconductor Device and Method of Forming t...

Semiconductor Package System and Method

Package-on-Package Structure Including a Thermal Isolation Material...

Semiconductor Package System and Method

Methods for Stud Bump Formation and Apparatus for Performing the Same

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING T...

PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL...

Fine Pitch Package-on-Package Structure

WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE

Fine-Pitch Package-on-Package Structures and Methods for Forming th...

Methods for Stud Bump Formation and Apparatus for Performing the Same