Tsan-Hsien Chen

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,410,942
- Issue date Sep 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tenon-and-mortise packaging structure
- Patent number 7,964,949
- Issue date Jun 21, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190164859
- Publication date May 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tenon-and-mortise packaging structure
- Publication number 20090096077
- Publication date Apr 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS