Tsan-Hua Tung

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of packaging semiconductor devices including placing semico...
- Patent number 10,964,594
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices including placing semico...
- Patent number 10,163,711
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and structures thereof
- Patent number 9,673,098
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and structures thereof
- Patent number 9,406,581
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device
- Patent number 9,312,148
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and structures thereof
- Patent number 9,117,682
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a molding compound and a method...
- Patent number 9,000,584
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PACKAGING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF
- Publication number 20190122929
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Structures Thereof
- Publication number 20170271209
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Structures Thereof
- Publication number 20160343615
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Structures Thereof
- Publication number 20150364395
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DEVICE
- Publication number 20150187605
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING THE SEMICONDU...
- Publication number 20130168848
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Structures Thereof
- Publication number 20130087916
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Tsan-Hua Tung

Person

Patents Grantslast 30 patents

Methods of packaging semiconductor devices including placing semico...

Methods of packaging semiconductor devices including placing semico...

Methods of packaging semiconductor devices and structures thereof

Methods of packaging semiconductor devices and structures thereof

Method of packaging a semiconductor device

Methods of packaging semiconductor devices and structures thereof

Packaged semiconductor device with a molding compound and a method...

Patents Applicationslast 30 patents

METHODS OF PACKAGING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF

Methods of Packaging Semiconductor Devices and Structures Thereof

Methods of Packaging Semiconductor Devices and Structures Thereof

Methods of Packaging Semiconductor Devices and Structures Thereof

METHOD OF PACKAGING A SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING THE SEMICONDU...

Methods of Packaging Semiconductor Devices and Structures Thereof