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Tsan Yin Peter LO
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Kwai Chung, HK
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Patents Grants
last 30 patents
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Patent Grant
Thermal compression bonding of semiconductor chips
Patent number
8,967,452
Issue date
Mar 3, 2015
ASM Technology Singapore Pte. Ltd.
Yiu Ming Cheung
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
Publication number
20130270230
Publication date
Oct 17, 2013
Yiu Ming CHEUNG
H01 - BASIC ELECTRIC ELEMENTS