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Taoyuan Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for improving the uniformity of wafer-to-wafer film thickness
Patent number
6,218,320
Issue date
Apr 17, 2001
United Microelectronics Corp.
Tsung-Lin Lu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for planarizing a damascene structure
Patent number
6,211,060
Issue date
Apr 3, 2001
United Microelectronics Corp.
Tsang-Jung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slurry providing system
Patent number
6,132,078
Issue date
Oct 17, 2000
United Integrated Circuits Corp.
Tsang-Jung Lin
B24 - GRINDING POLISHING
Information
Patent Grant
Chemical-mechanical polishing station with end-point monitoring device
Patent number
6,077,147
Issue date
Jun 20, 2000
United Microelectronics Corporation
Ming-Sheng Yang
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
Device for chemical mechanical polishing
Publication number
20030134581
Publication date
Jul 17, 2003
Hsing Maw Wang
B24 - GRINDING POLISHING
Information
Patent Application
Apparatus for chemical mechanical polishing
Publication number
20030114076
Publication date
Jun 19, 2003
Hui-Chun Chang
B24 - GRINDING POLISHING
Information
Patent Application
Method of depositing thin films and apparatus for depositing the same
Publication number
20030056727
Publication date
Mar 27, 2003
Tsang Jung Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CHEMICAL-MECHANICAL POLISHING APPARATUS WITH MEGASONIC ENERGY SLURR...
Publication number
20010050142
Publication date
Dec 13, 2001
TSANG-JUNG LIN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...