Tsang Kwok Cheung

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Fanbury, HK

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an integrated circuit package
- Patent number 6,790,710
- Issue date Sep 14, 2004
- ASAT Limited
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package
- Publication number 20050077613
- Publication date Apr 14, 2005
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated integrated circuit package and method of manufacturing...
- Publication number 20030143781
- Publication date Jul 31, 2003
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS