Tsao-Pin Chen

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Chu-Pei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Image sensor package structure with casing including a vent without...
- Patent number 8,847,146
- Issue date Sep 30, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,828,777
- Issue date Sep 9, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with large air cavity
- Patent number 8,390,087
- Issue date Mar 5, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure of a wafer level image sensor mo...
- Patent number 8,378,441
- Issue date Feb 19, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for molding image sensor package structure and...
- Patent number 8,093,674
- Issue date Jan 10, 2012
- Kingpak Technology, Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110241147
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...
- Publication number 20110241146
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...
- Publication number 20110024861
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY
- Publication number 20110024862
- Publication date Feb 3, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE
- Publication number 20110024610
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS