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Patents Grantslast 30 patents

Information Patent Grant
Halogen-free resin composition and copper clad laminate and printed...
- Patent number 9,422,412
- Issue date Aug 23, 2016
- ELITE MATERIAL CO., LTD.
- Li-Chih Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper-clad laminate and printed circuit board f...
- Patent number 9,394,438
- Issue date Jul 19, 2016
- ELITE MATERIAL CO., LTD.
- Li-Chih Yu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen-free resin composition, and copper clad laminate and printe...
- Patent number 9,279,051
- Issue date Mar 8, 2016
- Elite Material Co., Ltd.
- Li-Chih Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free resin composition
- Patent number 9,238,733
- Issue date Jan 19, 2016
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
- Chang-Yuan Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Lowdielectric resin composition, copper clad laminate using the sam...
- Patent number 9,131,607
- Issue date Sep 8, 2015
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Rong-Tao Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition and prepreg, laminate and circuit board thereof
- Patent number 8,404,764
- Issue date Mar 26, 2013
- Elite Material Co., Ltd.
- Li-Chih Yu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD F...
- Publication number 20140178696
- Publication date Jun 26, 2014
- ELITE MATERIAL CO., LTD.
- LI-CHIH YU
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAM...
- Publication number 20140174802
- Publication date Jun 26, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION
- Publication number 20130316155
- Publication date Nov 28, 2013
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
- CHANG-YUAN LI
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, AND COPPER CLAD LAMINATE AND PRINTE...
- Publication number 20130115472
- Publication date May 9, 2013
- ELITE MATERIAL CO., LTD.
- Li-Chih YU
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF
- Publication number 20130075136
- Publication date Mar 28, 2013
- Li-Chih YU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION AND COPPER CLAD LAMINATE AND PRINTED...
- Publication number 20130075138
- Publication date Mar 28, 2013
- Li-Chih YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR