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Tse E. Wong
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Los Alamitos, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Mechanically improved microelectronic thermal interface structure f...
Patent number
10,446,466
Issue date
Oct 15, 2019
Raytheon Company
Jason G. Milne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetically sealed package having stress reducing layer
Patent number
9,708,181
Issue date
Jul 18, 2017
Raytheon Company
Adam M. Kennedy
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Adaptive interposer and electronic apparatus
Patent number
9,706,662
Issue date
Jul 11, 2017
Raytheon Company
Tse E. Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stress reduction interposer for ceramic no-lead surface mount elect...
Patent number
9,648,729
Issue date
May 9, 2017
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetically sealed package having stress reducing layer
Patent number
9,334,154
Issue date
May 10, 2016
Raytheon Company
Adam M. Kennedy
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Stacked wafer with coolant channels
Patent number
8,921,992
Issue date
Dec 30, 2014
Raytheon Company
Christopher R. Koontz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit assembly
Patent number
7,888,176
Issue date
Feb 15, 2011
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit assembly
Patent number
7,605,477
Issue date
Oct 20, 2009
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board assembly and method of attaching a chip to a circuit...
Patent number
7,298,235
Issue date
Nov 20, 2007
Raytheon Company
Mark S. Hauhe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spring-loaded ball contact connector
Patent number
5,899,753
Issue date
May 4, 1999
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE F...
Publication number
20190341328
Publication date
Nov 7, 2019
Raytheon Company
Jason G. Milne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID MICRO-CIRCUIT DEVICE WITH STACKED CHIP COMPONENTS
Publication number
20180122777
Publication date
May 3, 2018
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS REDUCTION INTERPOSER FOR CERAMIC NO-LEAD SURFACE MOUNT ELECT...
Publication number
20170150596
Publication date
May 25, 2017
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS
Publication number
20170006705
Publication date
Jan 5, 2017
Tse E. Wong
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
Publication number
20160167959
Publication date
Jun 16, 2016
Raytheon Company
Adam M. Kennedy
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
Publication number
20160039665
Publication date
Feb 11, 2016
Raytheon Company
Adam M. Kennedy
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FLIP CHIP MMIC HAVING MOUNTING STIFFENER
Publication number
20150380343
Publication date
Dec 31, 2015
Raytheon Company
Christopher R. Koontz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED WAFER WITH COOLANT CHANNELS
Publication number
20140264759
Publication date
Sep 18, 2014
Christopher R. KOONTZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADAPTIVE THERMAL GAP PAD
Publication number
20120155029
Publication date
Jun 21, 2012
Raytheon Company
Tse Eric Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT ASSEMBLY
Publication number
20100003785
Publication date
Jan 7, 2010
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked integrated circuit assembly
Publication number
20080179758
Publication date
Jul 31, 2008
Raytheon Company
Tse E. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit board assembly and method of attaching a chip to a circuit...
Publication number
20050151215
Publication date
Jul 14, 2005
Mark S. Hauhe
H01 - BASIC ELECTRIC ELEMENTS