Tse-Hsine Laio

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Xindian City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and heat dissipating metal surface layout the...
- Patent number 7,474,541
- Issue date Jan 6, 2009
- Giga-Byte Technology Co., Ltd.
- Tse-Hsine Laio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of interface card connector
- Patent number 7,300,315
- Issue date Nov 27, 2007
- Giga-Byte Technology Co. Ltd.
- Chih-Ming Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating type printed circuit board and structure thereof f...
- Patent number 7,295,441
- Issue date Nov 13, 2007
- Giga-Gyte Technology Co. Ltd.
- Tse-Hsine Laio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board and Heat Dissipating Metal Surface Layout the...
- Publication number 20070261882
- Publication date Nov 15, 2007
- Tse-Hsine Laio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING TYPE PRINTED CIRCUIT BOARD AND STRUCTURE THEREOF F...
- Publication number 20070263362
- Publication date Nov 15, 2007
- Tse-Hsine Laio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of interface card connector
- Publication number 20070254526
- Publication date Nov 1, 2007
- GIGA-BYTE TECHNOLOGY CO., LTD.
- Chih-Ming Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR