Tse-Huang Lo

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Jiangsu, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor thick metal structure
- Patent number 8,956,972
- Issue date Feb 17, 2015
- CSMC Technologies Fab1 Co., Ltd.
- Hsiao-Chia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor burie...
- Patent number 8,889,535
- Issue date Nov 18, 2014
- CSMC Technologies Fab1 Co., Ltd.
- Hua Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR THICK METAL STRUCTURE
- Publication number 20140329385
- Publication date Nov 6, 2014
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Hsiao-Chia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR BURIE...
- Publication number 20130134562
- Publication date May 30, 2013
- Hua Song
- H01 - BASIC ELECTRIC ELEMENTS