Tse-Yong Yao

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier layer for electroplating processes
- Patent number 6,790,776
- Issue date Sep 14, 2004
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control of a substrate
- Patent number 6,607,640
- Issue date Aug 19, 2003
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post CU CMP polishing for reduced defects
- Patent number 6,436,302
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Juy-Lung Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce polish initiation time in a polish process
- Patent number 6,436,832
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Yutao Ma
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Barrier layer for electroplating processes
- Patent number 6,328,871
- Issue date Dec 11, 2001
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low thermal budget metal filling and planarization of co...
- Patent number 6,313,027
- Issue date Nov 6, 2001
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of tapered shadow clamp ring to provide improved physical vapor...
- Patent number 6,277,198
- Issue date Aug 21, 2001
- Applied Materials, Inc.
- Tse-Yong Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Filling narrow apertures and forming interconnects with a metal uti...
- Patent number 6,217,721
- Issue date Apr 17, 2001
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High pressure copper fill at low temperature
- Patent number 6,140,235
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Tse-Yong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for filling apertures in a film layer on a semiconductor...
- Patent number 6,136,095
- Issue date Oct 24, 2000
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of pulsed-DC wafer bias for filling vias/trenches with metal in...
- Patent number 6,051,114
- Issue date Apr 18, 2000
- Applied Materials, Inc.
- Tse-Yong Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having a low thermal budget metal filling and...
- Patent number 5,962,923
- Issue date Oct 5, 1999
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit structure having contact openings and vias fille...
- Patent number 5,847,461
- Issue date Dec 8, 1998
- Applied Materials, Inc.
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling of contact openings and vias by self-extrusion of...
- Patent number 5,668,055
- Issue date Sep 16, 1997
- Applied Materials, Inc.
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Barrier layer for electroplating processes
- Publication number 20050031784
- Publication date Feb 10, 2005
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier layer for electroplating processes
- Publication number 20020092772
- Publication date Jul 18, 2002
- Applied Materials.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for filling apertures in a film layer on a semiconductor...
- Publication number 20020089027
- Publication date Jul 11, 2002
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Temperature Control of a substrate
- Publication number 20010025783
- Publication date Oct 4, 2001
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tse-Yong Yao

Person

Patents Grantslast 30 patents

Barrier layer for electroplating processes

Temperature control of a substrate

Post CU CMP polishing for reduced defects

Method to reduce polish initiation time in a polish process

Barrier layer for electroplating processes

Method for low thermal budget metal filling and planarization of co...

Use of tapered shadow clamp ring to provide improved physical vapor...

Filling narrow apertures and forming interconnects with a metal uti...

High pressure copper fill at low temperature

Apparatus for filling apertures in a film layer on a semiconductor...

Use of pulsed-DC wafer bias for filling vias/trenches with metal in...

Semiconductor device having a low thermal budget metal filling and...

Integrated circuit structure having contact openings and vias fille...

Method of filling of contact openings and vias by self-extrusion of...

Patents Applicationslast 30 patents

Barrier layer for electroplating processes

Barrier layer for electroplating processes

Apparatus for filling apertures in a film layer on a semiconductor...

Temperature Control of a substrate