TSEI-CHUNG FU

Person

MIAOLI COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Protective layer for contact pads in fan-out interconnect structure...
- Patent number 11,515,288
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for contact pads in fan-out interconnect structure...
- Patent number 10,748,869
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 10,636,748
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,224,293
- Issue date Mar 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,163,818
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out POP structure with inconsecutive polymer layer
- Patent number 10,083,913
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for contact pads in fan-out interconnect structure...
- Patent number 9,941,244
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages and methods of forming same
- Patent number 9,847,269
- Issue date Dec 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 9,741,693
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 9,633,924
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out PoP structure with inconsecutive polymer layer
- Patent number 9,461,018
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding wheel design with elongated teeth arrangement
- Patent number 9,358,660
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsing Su
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE LAYER FOR CONTACT PADS IN FAN-OUT INTERCONNECT STRUCTURE...
- Publication number 20200350280
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure
- Publication number 20180301424
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective Layer for Contact Pads in Fan-out Interconnect Structure...
- Publication number 20180219000
- Publication date Aug 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method for Forming the Same
- Publication number 20170229404
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20170141079
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-FU KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES AND METHODS OF FORMING SAME
- Publication number 20170033063
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out POP Structure with Inconsecutive Polymer Layer
- Publication number 20170025359
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out POP Structure with Inconsecutive Polymer Layer
- Publication number 20160307871
- Publication date Oct 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grinding Wheel Design with Elongated Teeth Arrangement
- Publication number 20150258657
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective Layer for Contact Pads in Fan-out Interconnect Structure...
- Publication number 20150162289
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

TSEI-CHUNG FU

Person

Patents Grantslast 30 patents

Protective layer for contact pads in fan-out interconnect structure...

Protective layer for contact pads in fan-out interconnect structure...

Package structure

Package structure and method for forming the same

Package structure and method for forming the same

Fan-out POP structure with inconsecutive polymer layer

Protective layer for contact pads in fan-out interconnect structure...

Fan-out packages and methods of forming same

Semiconductor package and method of forming the same

Package structure and method for forming the same

Fan-out PoP structure with inconsecutive polymer layer

Grinding wheel design with elongated teeth arrangement

Patents Applicationslast 30 patents

PROTECTIVE LAYER FOR CONTACT PADS IN FAN-OUT INTERCONNECT STRUCTURE...

Package Structure

Protective Layer for Contact Pads in Fan-out Interconnect Structure...

Package Structure and Method for Forming the Same

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

FAN-OUT PACKAGES AND METHODS OF FORMING SAME

Fan-out POP Structure with Inconsecutive Polymer Layer

Fan-out POP Structure with Inconsecutive Polymer Layer

Grinding Wheel Design with Elongated Teeth Arrangement

Protective Layer for Contact Pads in Fan-out Interconnect Structure...