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Tsing Chow WANG

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BGA PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20120153470
    • Publication date Jun 21, 2012
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Lead Frame
    • Publication number 20090289337
    • Publication date Nov 26, 2009
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Forming Low Stress Multi-Layer Metallurgical Structures a...
    • Publication number 20090072396
    • Publication date Mar 19, 2009
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEAD FRAME
    • Publication number 20080157307
    • Publication date Jul 3, 2008
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Die Semiconductor Package Structure and Method for Manufactur...
    • Publication number 20080157308
    • Publication date Jul 3, 2008
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for Fabricating Semiconductor Device
    • Publication number 20080153240
    • Publication date Jun 26, 2008
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fluxless Reflow Process for Bump Formation
    • Publication number 20080128476
    • Publication date Jun 5, 2008
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing-Chow Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Planar bond pad design and method of making the same
    • Publication number 20070023926
    • Publication date Feb 1, 2007
    • Semiconductor Manufacturing (Shanghai) Corporation
    • Tsing Chow Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of forming low stress multi-layer metallurgical structures a...
    • Publication number 20060234489
    • Publication date Oct 19, 2006
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tsing Chow Wang
    • H01 - BASIC ELECTRIC ELEMENTS