Tso-Hung Yeh

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Yung-Ho City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Laminate circuit board with a multi-layer circuit structure
- Patent number 8,754,328
- Issue date Jun 17, 2014
- Kinsus Interconnect Technology Corp.
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing coreless substrate
- Patent number 7,353,591
- Issue date Apr 8, 2008
- Kinsus Interconnect Technology Corp.
- Tso-Hung Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE CIRCUIT BOARD STRUCTURE
- Publication number 20130284500
- Publication date Oct 31, 2013
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD
- Publication number 20130255858
- Publication date Oct 3, 2013
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE CIRCUIT BOARD WITH A MULTI-LAYER CIRCUIT STRUCTURE
- Publication number 20130224513
- Publication date Aug 29, 2013
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD WITH A MULTILAYER...
- Publication number 20130219713
- Publication date Aug 29, 2013
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method Of Manufacturing Coreless Substrate
- Publication number 20070245551
- Publication date Oct 25, 2007
- Tso-Hung Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR