Tsu-Hsiu WU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,776,889
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,626,525
- Issue date Apr 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun Yu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated optical diffuser and filter
- Patent number 11,569,422
- Issue date Jan 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Tang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,024,570
- Issue date Jun 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230037713
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Tang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED OPTICAL DIFFUSER AND FILTER
- Publication number 20220077364
- Publication date Mar 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Tang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220077326
- Publication date Mar 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun Yu KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE STRUCTURE AND OPTICAL MODULE STRUCTURE
- Publication number 20210313476
- Publication date Oct 7, 2021
- Advanced Semiconductor Engineering, Inc.
- Chun Yu KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210296244
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Hsin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303294
- Publication date Sep 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Hsin CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Tsu-Hsiu WU

Person

Patents Grantslast 30 patents

Semiconductor package device and method of manufacturing the same

Package structure and method for manufacturing the same

Semiconductor package with integrated optical diffuser and filter

Semiconductor package device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH INTEGRATED OPTICAL DIFFUSER AND FILTER

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL SENSOR PACKAGE STRUCTURE AND OPTICAL MODULE STRUCTURE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME