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Changhua County, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for achieving uniform CU CMP polishing
Patent number
7,153,197
Issue date
Dec 26, 2006
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Grant
Method for copper surface smoothing
Patent number
7,091,126
Issue date
Aug 15, 2006
Taiwan Semiconductor Manufacturing Company
Han-Hsin Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming patterned features at a semiconductor wafer peri...
Patent number
6,833,323
Issue date
Dec 21, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to eliminate via poison effect
Patent number
6,821,896
Issue date
Nov 23, 2004
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial feature for corrosion prevention during CMP
Patent number
6,787,470
Issue date
Sep 7, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Chu-Wei Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for damascene reworking
Patent number
6,767,833
Issue date
Jul 27, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Eliminate broken line damage of copper after CMP
Patent number
6,736,701
Issue date
May 18, 2004
Taiwan Semiconductor Manufacturing Company
Shau-Lin Shue
B24 - GRINDING POLISHING
Information
Patent Grant
Method for preventing localized Cu corrosion during CMP
Patent number
6,726,535
Issue date
Apr 27, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polisher equipped with chilled retaining ring a...
Patent number
6,686,284
Issue date
Feb 3, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Chi-Wei Chung
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus and method for linear polishing
Patent number
6,682,396
Issue date
Jan 27, 2004
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Grant
Method for preventing or reducing anodic Cu corrosion during CMP
Patent number
6,638,868
Issue date
Oct 28, 2003
Taiwan Semiconductor Manufacturing Co. Ltd
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Grant
Bimodal slurry system
Patent number
6,638,328
Issue date
Oct 28, 2003
Taiwan Semiconductor Manufacturing Co. Ltd
Shen-Nan Lee
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method and apparatus for preventing metal corrosion during chemical...
Patent number
6,634,930
Issue date
Oct 21, 2003
Taiwan Semiconductor Manufacturing Co. Ltd
Ying-Ho Chen
B24 - GRINDING POLISHING
Information
Patent Grant
Reinforced polishing pad for linear chemical mechanical polishing a...
Patent number
6,635,211
Issue date
Oct 21, 2003
Taiwan Semiconductor Manufacturing Co. Ltd
Wen-Chih Chiou
B24 - GRINDING POLISHING
Information
Patent Grant
Reduction of Cu line damage by two-step CMP
Patent number
6,620,725
Issue date
Sep 16, 2003
Taiwan Semiconductor Manufacturing Company
Shau-Lin Shue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Way to remove Cu line damage after Cu CMP
Patent number
6,620,034
Issue date
Sep 16, 2003
Taiwan Semiconductor Manufacturing Company
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Grant
Method for protecting sidewalls of etched openings to prevent via p...
Patent number
6,602,780
Issue date
Aug 5, 2003
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming metal filled semiconductor features to improve a...
Patent number
6,599,838
Issue date
Jul 29, 2003
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of replicating alignment marks for semiconductor wafer photo...
Patent number
6,589,852
Issue date
Jul 8, 2003
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of low-high slurry flow to eliminate copper line damages
Patent number
6,589,872
Issue date
Jul 8, 2003
Taiwan Semiconductor Manufacturing Company
Jih-Churng Twu
B24 - GRINDING POLISHING
Information
Patent Grant
Method to eliminate post-CMP copper flake defect
Patent number
6,544,891
Issue date
Apr 8, 2003
Taiwan Semiconductor Manufacturing Company
Ying-Ho Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Liquid phase deposition of a silicon oxide layer for use as a liner...
Patent number
6,518,166
Issue date
Feb 11, 2003
Taiwan Semiconductor Manufacturing Company
Sheng Hsiung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduction of metal corrosion in semiconductor devices
Patent number
6,515,366
Issue date
Feb 4, 2003
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Chih Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad having variable density via support and method for fabrica...
Patent number
6,501,186
Issue date
Dec 31, 2002
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to reduce capacitance for copper interconnect structures
Patent number
6,495,452
Issue date
Dec 17, 2002
Taiwan Semiconductor Manufacturing Company
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for photo alignment after CMP planarization
Patent number
6,465,897
Issue date
Oct 15, 2002
Taiwan Semiconductor Manufacturing Company
Tsu Shih
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Use of PE-SiON or PE-Oxide for contact or via photo and for defect...
Patent number
6,458,689
Issue date
Oct 1, 2002
Taiwan Semiconductor Manufacturing Company
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of die loss to chemical mechanical polishing
Patent number
6,444,371
Issue date
Sep 3, 2002
Taiwan Semiconductor Manufacturing Company
Syun-Ming Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polishing platen equipped with guard ring for chemical mechanical p...
Patent number
6,443,810
Issue date
Sep 3, 2002
Taiwan Semiconductor Manufacturing Co., Ltd
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Grant
Elimination of electrochemical deposition copper line damage for da...
Patent number
6,429,118
Issue date
Aug 6, 2002
Taiwan Semiconductor Manufacturing Company
Ying-Ho Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Tungsten-copper interconnect and method for fabricating the same
Publication number
20050064629
Publication date
Mar 24, 2005
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for copper surface smoothing
Publication number
20040214441
Publication date
Oct 28, 2004
Han-Hsin Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming patterned features at a semiconductor wafer peri...
Publication number
20040147128
Publication date
Jul 29, 2004
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to reduce dishing, erosion and low-k dielectric peeling for...
Publication number
20040137740
Publication date
Jul 15, 2004
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Chi-Wei Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple layer copper deposition to improve CMP performance
Publication number
20040067640
Publication date
Apr 8, 2004
Taiwan Semiconductor Manufacturing Co., Ltd.
Leon Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for demascene reworking
Publication number
20040005782
Publication date
Jan 8, 2004
Taiwan Semiconductor Manufacuring Co., Ltd.
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sacrificial feature for corrosion prevention during CMP
Publication number
20030216047
Publication date
Nov 20, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Chu-Wei Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for achieving uniform CU CMP polishing
Publication number
20030211814
Publication date
Nov 13, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR PREVENTING OR REDUCING ANODIC CU CORROSION DURING CMP
Publication number
20030211744
Publication date
Nov 13, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Application
Use of low-high slurry flow to eliminate copper line damages
Publication number
20030207582
Publication date
Nov 6, 2003
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Jih-Churng Twu
B24 - GRINDING POLISHING
Information
Patent Application
Method for preventing localized Cu corrosion during CMP
Publication number
20030203706
Publication date
Oct 30, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BIMODAL SLURRY SYSTEM
Publication number
20030200702
Publication date
Oct 30, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Shen-Nan Lee
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Method for preventing chemical attack on a copper containing semico...
Publication number
20030154999
Publication date
Aug 21, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsu Shih
B08 - CLEANING
Information
Patent Application
Chemical mechanical polisher equipped with chilled retaining ring a...
Publication number
20030148615
Publication date
Aug 7, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Chi-Wei Chung
B24 - GRINDING POLISHING
Information
Patent Application
Method for protecting sidewalls of etched openings to prevent via p...
Publication number
20030045124
Publication date
Mar 6, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reinforced polishing pad for linear chemical mechanical polishing a...
Publication number
20030013398
Publication date
Jan 16, 2003
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Chih Chiou
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Novel way to remove Cu line damage after Cu CMP
Publication number
20020064971
Publication date
May 30, 2002
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Tsu Shih
B24 - GRINDING POLISHING
Information
Patent Application
Use of PE-SiON or PE-Oxide for contact or via photo and for defect...
Publication number
20010016414
Publication date
Aug 23, 2001
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS