Tsubasa BANDO

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device and apparatus for man...
- Patent number 12,068,165
- Issue date Aug 20, 2024
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method of composite substrate including resin and grinding...
- Patent number 11,745,299
- Issue date Sep 5, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MAN...
- Publication number 20220293425
- Publication date Sep 15, 2022
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD AND GRINDING APPARATUS
- Publication number 20220266419
- Publication date Aug 25, 2022
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Tsubasa BANDO
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD OF COMPOSITE SUBSTRATE INCLUDING RESIN AND GRINDING...
- Publication number 20200198083
- Publication date Jun 25, 2020
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE GRINDING DEVICE AND SUBSTRATE GRINDING METHOD
- Publication number 20200086450
- Publication date Mar 19, 2020
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Satoru IDE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066507
- Publication date Feb 27, 2020
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING