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Tsubasa Obata

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230073693
    • Publication date Mar 9, 2023
    • Disco Corporation
    • Tsubasa OBATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER BEAM ADJUSTMENT SYSTEM AND LASER PROCESSING APPARATUS
    • Publication number 20210170524
    • Publication date Jun 10, 2021
    • Disco Corporation
    • Tsubasa OBATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER DIVIDING METHOD
    • Publication number 20190348325
    • Publication date Nov 14, 2019
    • Disco Corporation
    • Tsubasa OBATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING GLASS INTERPOSER
    • Publication number 20190019692
    • Publication date Jan 17, 2019
    • Disco Corporation
    • Tsubasa Obata
    • C03 - GLASS MINERAL OR SLAG WOOL
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180308711
    • Publication date Oct 25, 2018
    • Disco Corporation
    • Tsubasa Obata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180130709
    • Publication date May 10, 2018
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20180122700
    • Publication date May 3, 2018
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170133269
    • Publication date May 11, 2017
    • Disco Corporation
    • Tsubasa Obata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170117434
    • Publication date Apr 27, 2017
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160343614
    • Publication date Nov 24, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160315011
    • Publication date Oct 27, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160111331
    • Publication date Apr 21, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160027696
    • Publication date Jan 28, 2016
    • Disco Corporation
    • Kensuke Nagaoka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATE-LIKE OBJECT PROCESSING METHOD
    • Publication number 20150255288
    • Publication date Sep 10, 2015
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS