Tsubasa Shimizu

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Kanagawa, JP

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Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR ASSEMBLY METHOD, IN-VEHICLE EQUIPMENT ASSEMBLY METHOD, CO...
- Publication number 20230275370
- Publication date Aug 31, 2023
- HIROSE ELECTRIC CO., LTD.
- Kentaro DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY METHOD, IN-VEHICLE EQUIPMENT ASSEMBLY METHOD, CO...
- Publication number 20210111500
- Publication date Apr 15, 2021
- HIROSE ELECTRIC CO., LTD.
- Kentaro DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging bag for semiconductor wafer and method of packaging semic...
- Publication number 20020153526
- Publication date Oct 24, 2002
- Kohei Toyama
- H01 - BASIC ELECTRIC ELEMENTS