Tsugio Nakata

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Ibaraki-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Structure of bonding plastic part insert-molded with wiring board a...
- Patent number 7,172,469
- Issue date Feb 6, 2007
- Ohi Seisakusho Co., Ltd.
- Haruo Mochida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structure of bonding plastic part insert-molded with wiring board a...
- Publication number 20040123947
- Publication date Jul 1, 2004
- OHI SEISAKUSHO CO., LTD.
- Haruo Mochida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR