Tsukasa Akutsu

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Imaichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for preparing porous electrolytic metal foil
- Patent number 6,153,077
- Issue date Nov 28, 2000
- Circuit Foil Japan Co., Ltd.
- Hitoshi Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making electrodeposited copper foil
- Patent number 4,976,826
- Issue date Dec 11, 1990
- Furukawa Circuit Foil Co., Ltd.
- Toshio Tani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR