Tsukasa ICHIKAWA

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Kanzaki-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220005781
- Publication date Jan 6, 2022
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS