Tsukasa Matsuda

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma enhanced atomic layer deposition system and method
- Patent number 8,486,845
- Issue date Jul 16, 2013
- Tokyo Electron Limited
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced atomic layer deposition system and method
- Patent number 8,163,087
- Issue date Apr 24, 2012
- Tokyo Electron Limited
- Jacques Faguet
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method, plasma film forming apparatus and storage medium
- Patent number 8,026,176
- Issue date Sep 27, 2011
- Tokyo Electron Limited
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of integrating PEALD Ta-containing films into Cu metallization
- Patent number 7,959,985
- Issue date Jun 14, 2011
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced atomic layer deposition system
- Patent number 7,651,568
- Issue date Jan 26, 2010
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for forming a variable thickness seed layer
- Patent number 7,351,285
- Issue date Apr 1, 2008
- Tokyo Electron Limited
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Film Forming Method, Plasma Film Forming Apparatus and Storage Medium
- Publication number 20100167540
- Publication date Jul 1, 2010
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seed Film Forming Method, Plasma-Assisted Film Forming System and S...
- Publication number 20090183984
- Publication date Jul 23, 2009
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of integrating PEALD Ta- containing films into Cu metallization
- Publication number 20070218683
- Publication date Sep 20, 2007
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced atomic layer deposition system and method
- Publication number 20060225655
- Publication date Oct 12, 2006
- TOKYO ELECTRON LIMITED
- Jacques Faguet
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and system for forming a variable thickness seed layer
- Publication number 20060219160
- Publication date Oct 5, 2006
- TOKYO ELECTRON LIMITED
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced atomic layer deposition system
- Publication number 20060213438
- Publication date Sep 28, 2006
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced atomic layer deposition system and method
- Publication number 20060211224
- Publication date Sep 21, 2006
- TOKYO ELECTRON LIMITED
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tsukasa Matsuda

Person

Patents Grantslast 30 patents

Plasma enhanced atomic layer deposition system and method

Plasma enhanced atomic layer deposition system and method

Film forming method, plasma film forming apparatus and storage medium

Method of integrating PEALD Ta-containing films into Cu metallization

Plasma enhanced atomic layer deposition system

Method and system for forming a variable thickness seed layer

Patents Applicationslast 30 patents

Film Forming Method, Plasma Film Forming Apparatus and Storage Medium

Seed Film Forming Method, Plasma-Assisted Film Forming System and S...

Method of integrating PEALD Ta- containing films into Cu metallization

Plasma enhanced atomic layer deposition system and method

Method and system for forming a variable thickness seed layer

Plasma enhanced atomic layer deposition system

Plasma enhanced atomic layer deposition system and method