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Tsukasa Ohnishi

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Patents Grantslast 30 patents

  • Information Patent Grant

    Sn-Cu-based lead-free solder alloy
    • Patent number 10,137,536
    • Issue date Nov 27, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,076,808
    • Issue date Sep 18, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 9,844,837
    • Issue date Dec 19, 2017
    • Senju Metal Industry Co., Ltd.
    • Masato Shimamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy, connecting member and a method for its manu...
    • Patent number 9,773,721
    • Issue date Sep 26, 2017
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,700,963
    • Issue date Jul 11, 2017
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,527,167
    • Issue date Dec 27, 2016
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder connection structure and solder ball
    • Patent number 8,975,757
    • Issue date Mar 10, 2015
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 8,932,519
    • Issue date Jan 13, 2015
    • Senju Metal Industry Co., Ltd.
    • Seiko Ishibashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding material for semiconductor devices
    • Patent number 8,896,119
    • Issue date Nov 25, 2014
    • Senju Metal Industry Co., Ltd.
    • Yoshitsugu Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 8,691,143
    • Issue date Apr 8, 2014
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder
    • Patent number 8,220,692
    • Issue date Jul 17, 2012
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 8,216,395
    • Issue date Jul 10, 2012
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,682,468
    • Issue date Mar 23, 2010
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,338,567
    • Issue date Mar 4, 2008
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder and soldered article
    • Patent number 7,282,174
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder
    • Patent number 7,282,175
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder
    • Patent number 7,172,726
    • Issue date Feb 6, 2007
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,029,542
    • Issue date Apr 18, 2006
    • Senju Metal Industry Co., Ltd.
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for the treatment of eosinophil-associated diseases by admin...
    • Patent number 5,631,267
    • Issue date May 20, 1997
    • Mayo Foundation for Medical Education and Research
    • Gerald J. Gleich
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Grant

    Method for the treatment of bronchial asthma by administration of t...
    • Patent number 5,510,339
    • Issue date Apr 23, 1996
    • Mayo Foundation for Medical Education and Research
    • Gerald J. Gleich
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20160339543
    • Publication date Nov 24, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037088
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SN-CU-BASED LEAD-FREE SOLDER ALLOY
    • Publication number 20150029670
    • Publication date Jan 29, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANU...
    • Publication number 20140326490
    • Publication date Nov 6, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Shunsaku Yoshikawa
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20140141273
    • Publication date May 22, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Masato Shimamura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20140061287
    • Publication date Mar 6, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    SOLDER ALLOY
    • Publication number 20130343809
    • Publication date Dec 26, 2013
    • SENJU METAL INDUSTRY CO., LTD.
    • Seiko Ishibashi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Bonding Material for Semiconductor Devices
    • Publication number 20130134591
    • Publication date May 30, 2013
    • Yoshitsugu Sakamoto
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MAN...
    • Publication number 20120199393
    • Publication date Aug 9, 2012
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL
    • Publication number 20110115084
    • Publication date May 19, 2011
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER
    • Publication number 20110089224
    • Publication date Apr 21, 2011
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20100297470
    • Publication date Nov 25, 2010
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of Soldering a Module Board
    • Publication number 20090301760
    • Publication date Dec 10, 2009
    • Masato Shimamura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20090232696
    • Publication date Sep 17, 2009
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20080061117
    • Publication date Mar 13, 2008
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder
    • Publication number 20070243098
    • Publication date Oct 18, 2007
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder and soldered article
    • Publication number 20060102690
    • Publication date May 18, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20050036902
    • Publication date Feb 17, 2005
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder
    • Publication number 20040262779
    • Publication date Dec 30, 2004
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder
    • Publication number 20040115088
    • Publication date Jun 17, 2004
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20040062679
    • Publication date Apr 1, 2004
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20030021718
    • Publication date Jan 30, 2003
    • Osamu Munekata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...