Tsun-Jen Chan

Person

Pingzhen City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Techniques providing semiconductor wafer grouping in a feed forward...
- Patent number 10,522,427
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Jen Chan
- G05 - CONTROLLING REGULATING
Information Patent Grant
High temperature intermittent ion implantation
- Patent number 10,049,856
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput system and method for post-implantation single wafe...
- Patent number 9,982,338
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Jen Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-throughput system and method for post-implantation single wafe...
- Patent number 9,663,854
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Jen Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of high quality Fin in 3D structure by way of two-step im...
- Patent number 9,634,126
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of high quality fin in 3D structure by way of two-step im...
- Patent number 9,425,290
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature intermittent ion implantation
- Patent number 9,343,312
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of high quality fin in 3D structure by way of two-step im...
- Patent number 9,099,495
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230387316
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Throughput System and Method for Post-Implantation Single Wafe...
- Publication number 20170247790
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- TSUN-JEN CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF HIGH QUALITY FIN IN 3D STRUCTURE BY WAY OF TWO-STEP IM...
- Publication number 20160343831
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company., Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Temperature Intermittent Ion Implantation
- Publication number 20160027646
- Publication date Jan 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF HIGH QUALITY FIN IN 3D STRUCTURE BY WAY OF TWO-STEP IM...
- Publication number 20150340472
- Publication date Nov 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of High Quality Fin in 3D Structure by Way of Two-Step Im...
- Publication number 20150228766
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Feng Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Throughput System and Method for Post-Implantation Single Wafe...
- Publication number 20140273421
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- TSUN-JEN CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Techniques Providing Semiconductor Wafer Grouping In A Feed Forward...
- Publication number 20130011939
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Jen Chan
- H01 - BASIC ELECTRIC ELEMENTS

Tsun-Jen Chan

Person

Patents Grantslast 30 patents

Techniques providing semiconductor wafer grouping in a feed forward...

High temperature intermittent ion implantation

High-throughput system and method for post-implantation single wafe...

High-throughput system and method for post-implantation single wafe...

Formation of high quality Fin in 3D structure by way of two-step im...

Formation of high quality fin in 3D structure by way of two-step im...

High temperature intermittent ion implantation

Formation of high quality fin in 3D structure by way of two-step im...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

High-Throughput System and Method for Post-Implantation Single Wafe...

FORMATION OF HIGH QUALITY FIN IN 3D STRUCTURE BY WAY OF TWO-STEP IM...

High Temperature Intermittent Ion Implantation

FORMATION OF HIGH QUALITY FIN IN 3D STRUCTURE BY WAY OF TWO-STEP IM...

Formation of High Quality Fin in 3D Structure by Way of Two-Step Im...

High-Throughput System and Method for Post-Implantation Single Wafe...

Techniques Providing Semiconductor Wafer Grouping In A Feed Forward...