TREA

Tsuneharu Arai

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Patents Grantslast 30 patents

  • Information Patent Grant

    Die bonding method and apparatus
    • Patent number 6,547,902
    • Issue date Apr 15, 2003
    • Kabushiki Kaisha Shinkawa
    • Tsuneharu Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer ring feeding apparatus
    • Patent number 6,062,795
    • Issue date May 16, 2000
    • Kabushiki Kaisha Shinkawa
    • Shigeru Fuke
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer ring supply and return device
    • Patent number 5,853,532
    • Issue date Dec 29, 1998
    • Kabushiki Kaisha Shinkawa
    • Osamu Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer ring supply and return device
    • Patent number 5,824,185
    • Issue date Oct 20, 1998
    • Kabushiki Kaisha Shinkawa
    • Osamu Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die transporting device
    • Patent number 5,823,418
    • Issue date Oct 20, 1998
    • Kabushiki Kaisha Shinkawa
    • Osamu Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pellet pick-up device
    • Patent number 5,725,728
    • Issue date Mar 10, 1998
    • Kabushiki Kaisha Shinkawa
    • Shigeru Fuke
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,603,446
    • Issue date Feb 18, 1997
    • Kabushiki Kaisha Shinkawa
    • Eiji Kikuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Die bonding method and apparatus
    • Publication number 20010004002
    • Publication date Jun 21, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Tsuneharu Arai
    • H01 - BASIC ELECTRIC ELEMENTS