Tsung-Cheng CHAN

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor device structure having conductive...
- Patent number 10,475,742
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure having conductive...
- Patent number 10,283,450
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with twin boundaries and method for forming...
- Patent number 9,761,523
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing nano-sheet array structure of group V-VI semic...
- Patent number 9,023,663
- Issue date May 5, 2015
- National Tsing Hua University
- Yu-Lun Chueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal film with twins
- Patent number 8,420,185
- Issue date Apr 16, 2013
- National Tsing Hua University
- Yu-Lun Chueh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE HAVING CONDUCTIVE...
- Publication number 20190103351
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE HAVING CONDUCTIVE...
- Publication number 20170338178
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207194
- Publication date Jul 20, 2017
- XINTEC INC.
- Hsing-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH TWIN BOUNDARIES AND METHOD FOR FORMING...
- Publication number 20170053865
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING NANO-SHEET ARRAY STRUCTURE OF GROUP V-VI SEMIC...
- Publication number 20140329338
- Publication date Nov 6, 2014
- National Tsing Hua University
- Yu-Lun CHUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING COPPER NANOWIRE WITH HIGH DENSITY TWINS
- Publication number 20130270121
- Publication date Oct 17, 2013
- National Tsing-Hua University
- Chien-Neng LIAO
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR FORMING METAL FILM WITH TWINS
- Publication number 20130089674
- Publication date Apr 11, 2013
- Yu-Lun CHUEH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tsung-Cheng CHAN

Person

Patents Grantslast 30 patents

Method for forming semiconductor device structure having conductive...

Method for forming semiconductor device structure having conductive...

Interconnect structure with twin boundaries and method for forming...

Method for preparing nano-sheet array structure of group V-VI semic...

Method for forming metal film with twins

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE HAVING CONDUCTIVE...

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE HAVING CONDUCTIVE...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

INTERCONNECT STRUCTURE WITH TWIN BOUNDARIES AND METHOD FOR FORMING...

METHOD FOR PREPARING NANO-SHEET ARRAY STRUCTURE OF GROUP V-VI SEMIC...

METHOD FOR FABRICATING COPPER NANOWIRE WITH HIGH DENSITY TWINS

METHOD FOR FORMING METAL FILM WITH TWINS