Tsung-Chih Yu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Constant time buck-boost switching converter and modulation control...
- Patent number 12,273,031
- Issue date Apr 8, 2025
- Richtek Technology Corporation
- Hung-Yu Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,210,188
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having prism structure and manufacturing method thereof
- Patent number 12,164,158
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Grant
Cell placement optimization
- Patent number 12,159,904
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Capacitor in nanosheet
- Patent number 12,094,872
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct memory access data path for RAID storage
- Patent number 12,079,521
- Issue date Sep 3, 2024
- GRAID Technology Inc.
- Guo-Fu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-loop power converter and multi-loop error amplifier circuit a...
- Patent number 12,055,964
- Issue date Aug 6, 2024
- Richtek Technology Corporation
- Hung-Yu Cheng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die stacking structure and method forming same
- Patent number 12,002,799
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glitch preventing input/output circuits
- Patent number 11,984,883
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Hsin Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,984,444
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self timed level shifter circuit
- Patent number 11,855,629
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yen Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuit
- Patent number 11,804,546
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Jiun Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interconnect structure, package structure and fabricating m...
- Patent number 11,768,338
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device including optical through via and method of ma...
- Patent number 11,754,794
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- G02 - OPTICS
Information Patent Grant
Sound quality evaluation method and sound quality evaluation system...
- Patent number 11,756,569
- Issue date Sep 12, 2023
- ASUSTeK COMPUTER Inc.
- Chun-Chi Wang
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,754,780
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,785
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Jiun Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Direct memory access data path for RAID storage
- Patent number 11,662,955
- Issue date May 30, 2023
- GRAID Technology Inc.
- Guo-Fu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Storage system storing a plurality of disk files which correspond t...
- Patent number 11,630,582
- Issue date Apr 18, 2023
- Silicon Motion Technology (Hong Kong) Limited
- Kuan-Kai Chiu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND AUGMENTED REALITY DEVICE FOR PROVIDING AUGMENTED REALITY...
- Publication number 20250173941
- Publication date May 29, 2025
- Tsung-Hsiu YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUCK-BOOST SWITCHING REGULATOR AND CONTROL METHOD THEREOF
- Publication number 20250132680
- Publication date Apr 24, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Tung-Hang Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20250123458
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
METHOD FOR PERFORMING MAPPING BETWEEN ONE OR MORE RADIO MODULES AND...
- Publication number 20250119841
- Publication date Apr 10, 2025
- MEDIATEK INC.
- Tsung-Po Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR DYNAMICALLY ALLOCATING RADIO FREQUENCY EXPOSURE AMONG MU...
- Publication number 20250119173
- Publication date Apr 10, 2025
- MEDIATEK INC.
- Fu-Tse Kao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250110291
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND COMPUTING DEVICE FOR DISPLAYING VIRTUAL IMAGE TO USER
- Publication number 20250104364
- Publication date Mar 27, 2025
- Tsung-Hsiu YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE
- Publication number 20250060542
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
CIRCUITS DESIGNED AND MANUFACTURED WITH FIRST AND SECOND DESIGN RULES
- Publication number 20250031443
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PROVIDING SERVICE-RELATED DATA
- Publication number 20250022031
- Publication date Jan 16, 2025
- Tsung-Hsiu YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER CIRCUIT AND ASSOCIATED CONTROL METHOD
- Publication number 20240406043
- Publication date Dec 5, 2024
- Realtek Semiconductor Corp.
- Tsung-Nan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395756
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR IN NANOSHEET
- Publication number 20240387518
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
CELL PLACEMENT OPTIMIZATION
- Publication number 20240371942
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR BALUN AND POWER AMPLIFIER USING THE PLANAR BALUN
- Publication number 20240332764
- Publication date Oct 3, 2024
- National Tsing Hua University
- Tsun-Hsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DIRECTIVITY DIRECTIONAL COUPLER
- Publication number 20240332776
- Publication date Oct 3, 2024
- National Tsing Hua University
- Tsun-Hsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...
- Publication number 20240282721
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking Structure and Method Forming Same
- Publication number 20240274590
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLITCH PREVENTING INPUT/OUTPUT CIRCUITS
- Publication number 20240267044
- Publication date Aug 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Hsin YU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240258305
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-HUI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240234400
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME
- Publication number 20240178102
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Ti LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240178150
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng LIU
- H01 - BASIC ELECTRIC ELEMENTS

Tsung-Chih Yu

Person

Patents Grantslast 30 patents

Constant time buck-boost switching converter and modulation control...

Method of fabricating semiconductor package

Semiconductor package and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Manufacturing method of semiconductor package

Package having prism structure and manufacturing method thereof

Cell placement optimization

Semiconductor package and method of manufacturing the same

Semiconductor package

Capacitor in nanosheet

Direct memory access data path for RAID storage

Multi-loop power converter and multi-loop error amplifier circuit a...

Die stacking structure and method forming same

Glitch preventing input/output circuits

Semiconductor device and method of manufacturing the same

Package structure

Photonic semiconductor device and method of manufacture

Semiconductor package and method of fabricating the same

Self timed level shifter circuit

Photonic integrated circuit and package structure

Structure and method for integrated circuit

Optical interconnect structure, package structure and fabricating m...

Semiconductor device including optical through via and method of ma...

Sound quality evaluation method and sound quality evaluation system...

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Direct memory access data path for RAID storage

Semiconductor package and manufacturing method thereof

Storage system storing a plurality of disk files which correspond t...

Patents Applicationslast 30 patents

METHOD AND AUGMENTED REALITY DEVICE FOR PROVIDING AUGMENTED REALITY...

BUCK-BOOST SWITCHING REGULATOR AND CONTROL METHOD THEREOF

Photonic Semiconductor Device and Method of Manufacture

METHOD FOR PERFORMING MAPPING BETWEEN ONE OR MORE RADIO MODULES AND...

METHOD FOR DYNAMICALLY ALLOCATING RADIO FREQUENCY EXPOSURE AMONG MU...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

METHOD AND COMPUTING DEVICE FOR DISPLAYING VIRTUAL IMAGE TO USER

SEMICONDUCTOR PACKAGE

PACKAGE HAVING PRISM STRUCTURE

CIRCUITS DESIGNED AND MANUFACTURED WITH FIRST AND SECOND DESIGN RULES

METHOD FOR PROVIDING SERVICE-RELATED DATA

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

TRANSCEIVER CIRCUIT AND ASSOCIATED CONTROL METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CAPACITOR IN NANOSHEET

SEMICONDUCTOR PACKAGE

CELL PLACEMENT OPTIMIZATION

PLANAR BALUN AND POWER AMPLIFIER USING THE PLANAR BALUN

HIGH-DIRECTIVITY DIRECTIONAL COUPLER

PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...

3D Stacking Structure and Method of Fabricating the Same

Die Stacking Structure and Method Forming Same

GLITCH PREVENTING INPUT/OUTPUT CIRCUITS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

Photonic Semiconductor Device and Method of Manufacture

PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...