Tsung-Chih Yu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Capacitor in nanosheet
- Patent number 12,094,872
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct memory access data path for RAID storage
- Patent number 12,079,521
- Issue date Sep 3, 2024
- GRAID Technology Inc.
- Guo-Fu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-loop power converter and multi-loop error amplifier circuit a...
- Patent number 12,055,964
- Issue date Aug 6, 2024
- Richtek Technology Corporation
- Hung-Yu Cheng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die stacking structure and method forming same
- Patent number 12,002,799
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,984,444
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glitch preventing input/output circuits
- Patent number 11,984,883
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Hsin Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self timed level shifter circuit
- Patent number 11,855,629
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yen Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuit
- Patent number 11,804,546
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Jiun Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interconnect structure, package structure and fabricating m...
- Patent number 11,768,338
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device including optical through via and method of ma...
- Patent number 11,754,794
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- G02 - OPTICS
Information Patent Grant
Sound quality evaluation method and sound quality evaluation system...
- Patent number 11,756,569
- Issue date Sep 12, 2023
- ASUSTeK COMPUTER Inc.
- Chun-Chi Wang
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,754,780
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,785
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Jiun Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Direct memory access data path for RAID storage
- Patent number 11,662,955
- Issue date May 30, 2023
- GRAID Technology Inc.
- Guo-Fu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Storage system storing a plurality of disk files which correspond t...
- Patent number 11,630,582
- Issue date Apr 18, 2023
- Silicon Motion Technology (Hong Kong) Limited
- Kuan-Kai Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,614,592
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input device
- Patent number 11,614,810
- Issue date Mar 28, 2023
- Pegatron Corporation
- Ming-Tse Kao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data transmission and protection system and method thereof
- Patent number 11,561,871
- Issue date Jan 24, 2023
- GRAID Technology Inc.
- Tsung-Lin Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,532,596
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 11,527,490
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking structure and method forming same
- Patent number 11,521,959
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuit
- Patent number 11,502,198
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Jiun Kuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR IN NANOSHEET
- Publication number 20240387518
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
CELL PLACEMENT OPTIMIZATION
- Publication number 20240371942
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR BALUN AND POWER AMPLIFIER USING THE PLANAR BALUN
- Publication number 20240332764
- Publication date Oct 3, 2024
- National Tsing Hua University
- Tsun-Hsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DIRECTIVITY DIRECTIONAL COUPLER
- Publication number 20240332776
- Publication date Oct 3, 2024
- National Tsing Hua University
- Tsun-Hsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking Structure and Method Forming Same
- Publication number 20240274590
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLITCH PREVENTING INPUT/OUTPUT CIRCUITS
- Publication number 20240267044
- Publication date Aug 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Hsin YU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240258305
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-HUI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240234400
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME
- Publication number 20240178102
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Ti LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240178150
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE HEATING SYSTEM AND PROCESS FOR DESORPTION OF CONTAMINATED...
- Publication number 20240149315
- Publication date May 9, 2024
- MEI LIN ENERGY TECHNOLOGY Co., Ltd.
- Tsung-Chih YU
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
Self Timed Level Shifter Circuit
- Publication number 20240088897
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yen Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240069277
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047332
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20240012213
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDHELD ELECTRONIC DEVICE
- Publication number 20230396904
- Publication date Dec 7, 2023
- ASUSTEK COMPUTER INC.
- Chun-Chi WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA...
- Publication number 20230384537
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230367062
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
MULTI-LOOP POWER CONVERTER AND MULTI-LOOP ERROR AMPLIFIER CIRCUIT A...
- Publication number 20230359232
- Publication date Nov 9, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Hung-Yu Cheng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230317825
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Shin-Jiun KUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20230280558
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230258881
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230236372
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS

Tsung-Chih Yu

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package

Capacitor in nanosheet

Direct memory access data path for RAID storage

Multi-loop power converter and multi-loop error amplifier circuit a...

Die stacking structure and method forming same

Semiconductor device and method of manufacturing the same

Glitch preventing input/output circuits

Package structure

Photonic semiconductor device and method of manufacture

Semiconductor package and method of fabricating the same

Self timed level shifter circuit

Photonic integrated circuit and package structure

Structure and method for integrated circuit

Optical interconnect structure, package structure and fabricating m...

Semiconductor device including optical through via and method of ma...

Sound quality evaluation method and sound quality evaluation system...

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Direct memory access data path for RAID storage

Semiconductor package and manufacturing method thereof

Storage system storing a plurality of disk files which correspond t...

Semiconductor devices and methods of manufacture

Input device

Data transmission and protection system and method thereof

Package structure and method of forming the same

Packaging devices and methods of manufacture thereof

Die stacking structure and method forming same

Structure and method for integrated circuit

Patents Applicationslast 30 patents

CAPACITOR IN NANOSHEET

SEMICONDUCTOR PACKAGE

CELL PLACEMENT OPTIMIZATION

PLANAR BALUN AND POWER AMPLIFIER USING THE PLANAR BALUN

HIGH-DIRECTIVITY DIRECTIONAL COUPLER

3D Stacking Structure and Method of Fabricating the Same

Die Stacking Structure and Method Forming Same

GLITCH PREVENTING INPUT/OUTPUT CIRCUITS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

Photonic Semiconductor Device and Method of Manufacture

PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

MICROWAVE HEATING SYSTEM AND PROCESS FOR DESORPTION OF CONTAMINATED...

Self Timed Level Shifter Circuit

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

HANDHELD ELECTRONIC DEVICE

METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MULTI-LOOP POWER CONVERTER AND MULTI-LOOP ERROR AMPLIFIER CIRCUIT A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Photonic Semiconductor Device and Method of Manufacture

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Semiconductor Devices and Methods of Manufacture