Tsung-Hsun CHIANG

Person

  • Hsinchu, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20250192112
    • Publication date Jun 12, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE INCLUDING CONTACT ISOLATION LAYER AND METHOD F...

    • Publication number 20250133760
    • Publication date Apr 24, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ching-Pai Hsu
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20250076991
    • Publication date Mar 6, 2025
    • ASUSTEK COMPUTER INC.
    • Sheng-Ta LIN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

    • Publication number 20250014988
    • Publication date Jan 9, 2025
    • Taiwan Semiconductor Manufacturing company Ltd.
    • SHU-CHENG LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES

    • Publication number 20240395721
    • Publication date Nov 28, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Sung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

    • Publication number 20240387549
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • LI-WEI LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STACKS

    • Publication number 20240387733
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ya-Wen YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Fabricating Method Thereof

    • Publication number 20240379660
    • Publication date Nov 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Cheng-Chien Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT-EMITTING ELEMENT

    • Publication number 20240266476
    • Publication date Aug 8, 2024
    • EPISTAR CORPORATION
    • Chao-Hsing CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR LIGHT-EMITTING DEVICE

    • Publication number 20240234635
    • Publication date Jul 11, 2024
    • EPISTAR CORPORATION
    • Chao-Hsing CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

    • Publication number 20240234375
    • Publication date Jul 11, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

    • Publication number 20240194591
    • Publication date Jun 13, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE

    • Publication number 20240178090
    • Publication date May 30, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Ming Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME

    • Publication number 20240178102
    • Publication date May 30, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chun-Ti LU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

    • Publication number 20240178120
    • Publication date May 30, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Ming Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20240170414
    • Publication date May 23, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Hsien Chiang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR LIGHT-EMITTING DEVICE

    • Publication number 20240136472
    • Publication date Apr 25, 2024
    • EPISTAR CORPORATION
    • Chao-Hsing CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FOLDABLE ELECTRONIC DEVICE

    • Publication number 20240117837
    • Publication date Apr 11, 2024
    • ASUSTek COMPUTER INC.
    • Tsung-Ju Chiang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    EMBEDDED METAL PADS

    • Publication number 20240088072
    • Publication date Mar 14, 2024
    • Micron Technology, Inc.
    • Tsung Han Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FOLDABLE ELECTRONIC DEVICE

    • Publication number 20240077914
    • Publication date Mar 7, 2024
    • ASUSTek COMPUTER INC.
    • Chih-Han Chang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD

    • Publication number 20230420331
    • Publication date Dec 28, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ban-Li Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

    • Publication number 20230395490
    • Publication date Dec 7, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT DEVICES WITH GATE SEALS

    • Publication number 20230387256
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Sheng-Chou Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF

    • Publication number 20230387210
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jui-Lin CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

    • Publication number 20230378140
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGES

    • Publication number 20230352357
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Hsien Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STRUCTURE

    • Publication number 20230275138
    • Publication date Aug 31, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yi-Ching HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT-EMITTING DEVICE

    • Publication number 20230261148
    • Publication date Aug 17, 2023
    • EPISTAR CORPORATION
    • Chao-Hsing CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BARRIER LAYER FOR CONTACT STRUCTURES OF SEMICONDUCTOR DEVICES

    • Publication number 20230260792
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hsin Hsiang TSENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

    • Publication number 20230245921
    • Publication date Aug 3, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUI-YU CHEN
    • H01 - BASIC ELECTRIC ELEMENTS