Tsung Ming Pai

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip package and fabricating process thereof
- Patent number 7,052,935
- Issue date May 30, 2006
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor chip package
- Patent number 7,023,079
- Issue date Apr 4, 2006
- Advanced Semiconductor Engineering, Inc.
- Sung-Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a stacked chip package
- Patent number 6,541,871
- Issue date Apr 1, 2003
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stacked chip package
- Patent number 6,503,776
- Issue date Jan 7, 2003
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a stacked chip package
- Patent number 6,387,728
- Issue date May 14, 2002
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip-chip package and fabricating process thereof
- Publication number 20040164426
- Publication date Aug 26, 2004
- Tsung-Ming Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multichip module
- Publication number 20020140073
- Publication date Oct 3, 2002
- Advanced Semiconductor Engineering, Inc.
- Tsung Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor chip package
- Publication number 20020125580
- Publication date Sep 12, 2002
- Advanced Semiconductor Engineering, Inc.
- Sung-Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a stacked chip package
- Publication number 20020094605
- Publication date Jul 18, 2002
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating stacked chip package
- Publication number 20020090753
- Publication date Jul 11, 2002
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS