Tsung Nan Lo

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device under bump structure and method therefor
- Patent number 11,728,308
- Issue date Aug 15, 2023
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless inter-component joints
- Patent number 10,390,440
- Issue date Aug 20, 2019
- NXP B.V.
- Tsung Nan Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE
- Publication number 20230378107
- Publication date Nov 23, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR
- Publication number 20230307402
- Publication date Sep 28, 2023
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR
- Publication number 20220344296
- Publication date Oct 27, 2022
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTER-COMPONENT JOINTS
- Publication number 20190239361
- Publication date Aug 1, 2019
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS