Tsung-Te Wang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 12,159,092
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium battery structure
- Patent number 12,034,158
- Issue date Jul 9, 2024
- Industrial Technology Research Institute
- Li-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for drone docking
- Patent number 11,906,982
- Issue date Feb 20, 2024
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Semiconductor package with through vias and stacked redistribution...
- Patent number 11,894,341
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 11,790,145
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,705,378
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with stacked dies and methods of forming the same
- Patent number 11,652,086
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion-conducting material, core-shell structure containing the same,...
- Patent number 11,539,046
- Issue date Dec 27, 2022
- Industrial Technology Research Institute
- Tsung-Hsiung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch device and communication method thereof
- Patent number 11,487,384
- Issue date Nov 1, 2022
- Novatek Microelectronics Corp.
- Tsung-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple electronic signature method
- Patent number 11,423,164
- Issue date Aug 23, 2022
- VYNCA, INC.
- Rush Bartlett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Management apparatus and management method thereof for electronic e...
- Patent number 11,410,133
- Issue date Aug 9, 2022
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for adjusting optical setting of optical input...
- Patent number 11,409,375
- Issue date Aug 9, 2022
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,404,342
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 11,392,742
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple electronic signature method
- Patent number 11,281,887
- Issue date Mar 22, 2022
- VYNCA, INC.
- Rush L. Bartlett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including dies having high-modulus dielectric...
- Patent number 11,270,921
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,244,879
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance structure for semiconductor packages and method...
- Patent number 11,158,614
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,145,639
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded underfilling for package on package devices
- Patent number 11,139,281
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fireproof battery module and fireproof layer
- Patent number 11,127,996
- Issue date Sep 21, 2021
- Industrial Technology Research Institute
- Sheng-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures in semiconductor packages and methods of...
- Patent number 11,101,209
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Keyswitch capable of identifying keycap change
- Patent number 11,094,481
- Issue date Aug 17, 2021
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,088,069
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facile clay exfoliation using polymer silicone surfactants
- Patent number 10,981,830
- Issue date Apr 20, 2021
- Industrial Science & Technology Network, Inc.
- Arthur Jing-Min Yang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Sling chair
- Patent number 10,918,220
- Issue date Feb 16, 2021
- Agio International Co., Ltd.
- Tsung-Ho Wang
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...

Patents Applicationslast 30 patents

Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COCKPIT DISPLAY SYSTEM
- Publication number 20240386854
- Publication date Nov 21, 2024
- AUO Corporation
- Yu-Chi CHEN
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MOBILE LANDING OF UNMANNED VEHICLE
- Publication number 20240343427
- Publication date Oct 17, 2024
- aiseed Inc.
- Tsung-Yuan Wang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines and The Method Forming the Same Through Stitching
- Publication number 20240310733
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...
- Publication number 20240250719
- Publication date Jul 25, 2024
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- LI-HSIANG SHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20240222215
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-INORGANIC COMPOSITE FILM AND LITHIUM BATTERY
- Publication number 20240178458
- Publication date May 30, 2024
- Industrial Technology Research Institute
- Ming-Yi LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBSTACLE AVOIDANCE SYSTEM AND METHOD FOR UNMANNED VEHICLE
- Publication number 20240126275
- Publication date Apr 18, 2024
- aiseed Inc.
- Tsung-Yuan Wang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods of Forming the Same
- Publication number 20240038646
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030157
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COLORING CIRCUIT LAYOUT AND SYSTEM FOR PERFORMING THE SAME
- Publication number 20230367942
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ping CHIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING...
- Publication number 20230358786
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- G01 - MEASURING TESTING
Information Patent Application
LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
- Publication number 20230319991
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- G01 - MEASURING TESTING
Information Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
- Publication number 20230307427
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20230307375
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230307305
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND ME...
- Publication number 20230307345
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS

Tsung-Te Wang

Person

Patents Grantslast 30 patents

Method for coloring circuit layout and system for performing the same

Semiconductor packages and methods of forming same

Lithium battery structure

Package structure comprising buffer layer for reducing thermal stre...

System and method for drone docking

Semiconductor package with through vias and stacked redistribution...

Method for coloring circuit layout and system for performing the same

Semiconductor packages and methods of forming the same

Packages with stacked dies and methods of forming the same

Ion-conducting material, core-shell structure containing the same,...

Semiconductor package having molded die and semiconductor die and m...

Touch device and communication method thereof

Multiple electronic signature method

Connector formation methods and packaged semiconductor devices

Management apparatus and management method thereof for electronic e...

Method and apparatus for adjusting optical setting of optical input...

Package structure comprising buffer layer for reducing thermal stre...

Method for coloring circuit layout and system for performing the same

Multiple electronic signature method

Semiconductor package including dies having high-modulus dielectric...

Semiconductor package

Thermal performance structure for semiconductor packages and method...

Semiconductor package and manufacturing method thereof

Molded underfilling for package on package devices

Fireproof battery module and fireproof layer

Redistribution structures in semiconductor packages and methods of...

Keyswitch capable of identifying keycap change

Semiconductor package and semiconductor device

Facile clay exfoliation using polymer silicone surfactants

Sling chair

Patents Applicationslast 30 patents

Multi-Die Package Structures Including Redistribution Layers

COCKPIT DISPLAY SYSTEM

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SYSTEM AND METHOD FOR MOBILE LANDING OF UNMANNED VEHICLE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

Redistribution Lines and The Method Forming the Same Through Stitching

AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...

ORGANIC-INORGANIC COMPOSITE FILM AND LITHIUM BATTERY

SEMICONDUCTOR PACKAGE

OBSTACLE AVOIDANCE SYSTEM AND METHOD FOR UNMANNED VEHICLE

Three-Dimensional Semiconductor Device and Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

Semiconductor Device Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...

METHOD FOR COLORING CIRCUIT LAYOUT AND SYSTEM FOR PERFORMING THE SAME

PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING...

LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF

Packages Including Interconnect Die Embedded in Package Substrates

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND ME...