Tsung-Te Wang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Automatic signal deployer, signal deployment system, automatic sign...
- Patent number 12,368,472
- Issue date Jul 22, 2025
- Far EasTone Telecommunications Co., Ltd.
- Li-Hsiang Shen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card substrate, substrate structure and method of fabricating...
- Patent number 12,345,740
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- G01 - MEASURING TESTING
Information Patent Grant
Stylus and touch device for encoding and transmitting signal having...
- Patent number 12,260,030
- Issue date Mar 25, 2025
- Novatek Microelectronics Corp.
- Tsung-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,218,021
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device which can determine a dirtiness level
- Patent number 12,216,063
- Issue date Feb 4, 2025
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G01 - MEASURING TESTING
Information Patent Grant
Optical navigation device and method capable of more efficiently sa...
- Patent number 12,210,690
- Issue date Jan 28, 2025
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 12,159,092
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium battery structure
- Patent number 12,034,158
- Issue date Jul 9, 2024
- Industrial Technology Research Institute
- Li-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for drone docking
- Patent number 11,906,982
- Issue date Feb 20, 2024
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Semiconductor package with through vias and stacked redistribution...
- Patent number 11,894,341
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 11,790,145
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,705,378
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with stacked dies and methods of forming the same
- Patent number 11,652,086
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion-conducting material, core-shell structure containing the same,...
- Patent number 11,539,046
- Issue date Dec 27, 2022
- Industrial Technology Research Institute
- Tsung-Hsiung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch device and communication method thereof
- Patent number 11,487,384
- Issue date Nov 1, 2022
- Novatek Microelectronics Corp.
- Tsung-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple electronic signature method
- Patent number 11,423,164
- Issue date Aug 23, 2022
- VYNCA, INC.
- Rush Bartlett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Management apparatus and management method thereof for electronic e...
- Patent number 11,410,133
- Issue date Aug 9, 2022
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for adjusting optical setting of optical input...
- Patent number 11,409,375
- Issue date Aug 9, 2022
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,404,342
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coloring circuit layout and system for performing the same
- Patent number 11,392,742
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ping Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple electronic signature method
- Patent number 11,281,887
- Issue date Mar 22, 2022
- VYNCA, INC.
- Rush L. Bartlett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including dies having high-modulus dielectric...
- Patent number 11,270,921
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,244,879
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE MATERIAL, ELECTRODE, BATTERY AND METHOD FOR FORMING THE E...
- Publication number 20250210665
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Tsung-Hsiung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD-MOUNTED APPARATUS AND SENSING METHOD
- Publication number 20250127411
- Publication date Apr 24, 2025
- PIXART IMAGING Inc.
- TSUNG-FA WANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250125224
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR NOTIFYING ENVIRONMENTAL POLLUTION STATUS
- Publication number 20250044270
- Publication date Feb 6, 2025
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Chia-Jui YANG
- G01 - MEASURING TESTING
Information Patent Application
INTERNAL RADIO WAVE TRANSMISSION SYSTEM OF BUILDING
- Publication number 20250039646
- Publication date Jan 30, 2025
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- TZUU-YAW LU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POSITIONING POLLUTANT-MEASURING SYSTEM
- Publication number 20250035603
- Publication date Jan 30, 2025
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Chia-Jui YANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR USE IN CONFIGURING OPTICAL INPUT DEVICE AN...
- Publication number 20250013318
- Publication date Jan 9, 2025
- PixArt Imaging Inc.
- Tsung-Fa Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COCKPIT DISPLAY SYSTEM
- Publication number 20240386854
- Publication date Nov 21, 2024
- AUO Corporation
- Yu-Chi CHEN
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MOBILE LANDING OF UNMANNED VEHICLE
- Publication number 20240343427
- Publication date Oct 17, 2024
- aiseed Inc.
- Tsung-Yuan Wang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines and The Method Forming the Same Through Stitching
- Publication number 20240310733
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...
- Publication number 20240250719
- Publication date Jul 25, 2024
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- LI-HSIANG SHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20240222215
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-INORGANIC COMPOSITE FILM AND LITHIUM BATTERY
- Publication number 20240178458
- Publication date May 30, 2024
- Industrial Technology Research Institute
- Ming-Yi LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBSTACLE AVOIDANCE SYSTEM AND METHOD FOR UNMANNED VEHICLE
- Publication number 20240126275
- Publication date Apr 18, 2024
- aiseed Inc.
- Tsung-Yuan Wang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods of Forming the Same
- Publication number 20240038646
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS

Tsung-Te Wang

Person

Patents Grantslast 30 patents

Automatic signal deployer, signal deployment system, automatic sign...

Semiconductor package

Probe card substrate, substrate structure and method of fabricating...

Stylus and touch device for encoding and transmitting signal having...

Semiconductor packages and methods of forming the same

Electronic device which can determine a dirtiness level

Optical navigation device and method capable of more efficiently sa...

Multi-die package structures including redistribution layers

Semiconductor package and manufacturing method thereof

Method for coloring circuit layout and system for performing the same

Semiconductor packages and methods of forming same

Lithium battery structure

Package structure comprising buffer layer for reducing thermal stre...

System and method for drone docking

Semiconductor package with through vias and stacked redistribution...

Method for coloring circuit layout and system for performing the same

Semiconductor packages and methods of forming the same

Packages with stacked dies and methods of forming the same

Ion-conducting material, core-shell structure containing the same,...

Semiconductor package having molded die and semiconductor die and m...

Touch device and communication method thereof

Multiple electronic signature method

Connector formation methods and packaged semiconductor devices

Management apparatus and management method thereof for electronic e...

Method and apparatus for adjusting optical setting of optical input...

Package structure comprising buffer layer for reducing thermal stre...

Method for coloring circuit layout and system for performing the same

Multiple electronic signature method

Semiconductor package including dies having high-modulus dielectric...

Semiconductor package

Patents Applicationslast 30 patents

ELECTRODE MATERIAL, ELECTRODE, BATTERY AND METHOD FOR FORMING THE E...

HEAD-MOUNTED APPARATUS AND SENSING METHOD

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEM FOR NOTIFYING ENVIRONMENTAL POLLUTION STATUS

INTERNAL RADIO WAVE TRANSMISSION SYSTEM OF BUILDING

POSITIONING POLLUTANT-MEASURING SYSTEM

METHOD AND APPARATUS FOR USE IN CONFIGURING OPTICAL INPUT DEVICE AN...

Multi-Die Package Structures Including Redistribution Layers

COCKPIT DISPLAY SYSTEM

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SYSTEM AND METHOD FOR MOBILE LANDING OF UNMANNED VEHICLE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

Redistribution Lines and The Method Forming the Same Through Stitching

AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...

ORGANIC-INORGANIC COMPOSITE FILM AND LITHIUM BATTERY

SEMICONDUCTOR PACKAGE

OBSTACLE AVOIDANCE SYSTEM AND METHOD FOR UNMANNED VEHICLE

Three-Dimensional Semiconductor Device and Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

Semiconductor Device Packages and Methods of Forming the Same