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Patents Grants
last 30 patents
Information
Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
Patent number
11,961,777
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for drone docking
Patent number
11,906,982
Issue date
Feb 20, 2024
Far EasTone Telecommunications Co., Ltd.
Herman Chunghwa Rao
B64 - AIRCRAFT AVIATION COSMONAUTICS
Information
Patent Grant
Semiconductor package with through vias and stacked redistribution...
Patent number
11,894,341
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for coloring circuit layout and system for performing the same
Patent number
11,790,145
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Ping Chiang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor packages and methods of forming the same
Patent number
11,705,378
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages with stacked dies and methods of forming the same
Patent number
11,652,086
Issue date
May 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion-conducting material, core-shell structure containing the same,...
Patent number
11,539,046
Issue date
Dec 27, 2022
Industrial Technology Research Institute
Tsung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having molded die and semiconductor die and m...
Patent number
11,538,761
Issue date
Dec 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Touch device and communication method thereof
Patent number
11,487,384
Issue date
Nov 1, 2022
Novatek Microelectronics Corp.
Tsung-Yu Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multiple electronic signature method
Patent number
11,423,164
Issue date
Aug 23, 2022
VYNCA, INC.
Rush Bartlett
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Connector formation methods and packaged semiconductor devices
Patent number
11,424,199
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Management apparatus and management method thereof for electronic e...
Patent number
11,410,133
Issue date
Aug 9, 2022
Far EasTone Telecommunications Co., Ltd.
Herman Chunghwa Rao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and apparatus for adjusting optical setting of optical input...
Patent number
11,409,375
Issue date
Aug 9, 2022
PixArt Imaging Inc.
Tsung-Fa Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
Patent number
11,404,342
Issue date
Aug 2, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for coloring circuit layout and system for performing the same
Patent number
11,392,742
Issue date
Jul 19, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Ping Chiang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multiple electronic signature method
Patent number
11,281,887
Issue date
Mar 22, 2022
VYNCA, INC.
Rush L. Bartlett
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package including dies having high-modulus dielectric...
Patent number
11,270,921
Issue date
Mar 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,244,879
Issue date
Feb 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal performance structure for semiconductor packages and method...
Patent number
11,158,614
Issue date
Oct 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,145,639
Issue date
Oct 12, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded underfilling for package on package devices
Patent number
11,139,281
Issue date
Oct 5, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fireproof battery module and fireproof layer
Patent number
11,127,996
Issue date
Sep 21, 2021
Industrial Technology Research Institute
Sheng-Fa Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution structures in semiconductor packages and methods of...
Patent number
11,101,209
Issue date
Aug 24, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Keyswitch capable of identifying keycap change
Patent number
11,094,481
Issue date
Aug 17, 2021
PixArt Imaging Inc.
Tsung-Fa Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package and semiconductor device
Patent number
11,088,069
Issue date
Aug 10, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Facile clay exfoliation using polymer silicone surfactants
Patent number
10,981,830
Issue date
Apr 20, 2021
Industrial Science & Technology Network, Inc.
Arthur Jing-Min Yang
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Sling chair
Patent number
10,918,220
Issue date
Feb 16, 2021
Agio International Co., Ltd.
Tsung-Ho Wang
A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information
Patent Grant
Pen mouse
Patent number
10,901,538
Issue date
Jan 26, 2021
PixArt Imaging Inc.
Yen-Chang Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Dam for three-dimensional integrated circuit
Patent number
10,867,878
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate design for semiconductor packages and method of forming same
Patent number
10,867,949
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ORGANIC-INORGANIC COMPOSITE FILM AND LITHIUM BATTERY
Publication number
20240178458
Publication date
May 30, 2024
Industrial Technology Research Institute
Ming-Yi LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128232
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OBSTACLE AVOIDANCE SYSTEM AND METHOD FOR UNMANNED VEHICLE
Publication number
20240126275
Publication date
Apr 18, 2024
aiseed Inc.
Tsung-Yuan Wang
B64 - AIRCRAFT AVIATION COSMONAUTICS
Information
Patent Application
Three-Dimensional Semiconductor Device and Method
Publication number
20240105631
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jeng-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240071939
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240071999
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tseng Hsing Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240061037
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
Publication number
20240055468
Publication date
Feb 15, 2024
TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
Publication number
20240047322
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
Publication number
20240047509
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Packages and Methods of Forming the Same
Publication number
20240038646
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...
Publication number
20240030157
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR COLORING CIRCUIT LAYOUT AND SYSTEM FOR PERFORMING THE SAME
Publication number
20230367942
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Ping CHIANG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING...
Publication number
20230358786
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
G01 - MEASURING TESTING
Information
Patent Application
LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
Publication number
20230319991
Publication date
Oct 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Cheng Hou
G01 - MEASURING TESTING
Information
Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
Publication number
20230307427
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-Chi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming the Same
Publication number
20230307375
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230307305
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND ME...
Publication number
20230307345
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Stacked Dies and Methods of Forming the Same
Publication number
20230253369
Publication date
Aug 10, 2023
Chien-Hsun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD OF USING BASE STATION ALGORITHM TO PLAN EMERGENT...
Publication number
20230245556
Publication date
Aug 3, 2023
FAR EASTONE TELECOMMUNICATIONS CO., LTD.
CHUNG HWA RAO
G08 - SIGNALLING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230009901
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20220392832
Publication date
Dec 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME
Publication number
20220367366
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Connector Formation Methods and Packaged Semiconductor Devices
Publication number
20220359436
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Jung Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR COLORING CIRCUIT LAYOUT AND SYSTEM FOR PERFORMING THE SAME
Publication number
20220335192
Publication date
Oct 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Ping CHIANG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
Publication number
20220328372
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220216153
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Cheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHANNEL INFORMATION-BASED FREQUENCY TUNING OF ANTENNAS
Publication number
20220052436
Publication date
Feb 17, 2022
HewlettPackard Development Company, L.P.
Yao Cheng Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20220020655
Publication date
Jan 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS